Diodes
BAP70AM,135
NXP Semiconductors
Description: BAP70AM - Silicon PIN diode array TSSOP 6-Pin

Overview of BAP70AM,135 by NXP Semiconductors

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Space Technology Aerospace and Defense

Price & Stock for BAP70AM,135 by NXP Semiconductors

Part # Manufacturer Description Stock Price Buy
DISTI # 85AK8140
Newark Bap70Am/ Reel Rohs Compliant: Yes |Nxp BAP70AM,135 RoHS: Compliant Min Qty: 10000 Package Multiple: 1 Date Code: 0 Container: Bulk 0
  • 10,000 $0.2310
$0.2310 Buy Now
DISTI # BAP70AM,135
Avnet Americas BAP70AM - PIN DIODE - Tape and Reel (Alt: BAP70AM,135) RoHS: Compliant Min Qty: 1412 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Reel 10000 Partner Stock
RFQ
Rochester Electronics BAP70AM - Pin Diode RoHS: Compliant Status: Obsolete Min Qty: 1 10000
  • 1 $0.2583
  • 25 $0.2531
  • 100 $0.2428
  • 500 $0.2325
  • 1,000 $0.2196
$0.2196 / $0.2583 Buy Now

CAD Models for BAP70AM,135 by NXP Semiconductors
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Part Data Attributes for BAP70AM,135 by NXP Semiconductors

BAP70AM,135
NXP Semiconductors
-
-
Rohs Code
Yes
Part Life Cycle Code
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
Part Package Code
TSSOP
Package Description
R-PDSO-G6
Pin Count
6
Manufacturer Package Code
SOT363
Reach Compliance Code
compliant
ECCN Code
EAR99
HTS Code
8541.10.00
Factory Lead Time
4 Weeks
Samacsys Manufacturer
NXP
Additional Feature
LOW DISTORTION
Application
ATTENUATOR
Breakdown Voltage-Min
50 V
Configuration
2 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
Diode Capacitance-Max
0.25 pF
Diode Element Material
SILICON
Diode Forward Resistance-Max
1.9 Ω
Diode Type
PIN DIODE
Forward Voltage-Max (VF)
1.1 V
JESD-30 Code
R-PDSO-G6
JESD-609 Code
e3
Minority Carrier Lifetime-Nom
1.25 µs
Moisture Sensitivity Level
1
Number of Elements
4
Number of Terminals
6
Operating Temperature-Max
150 °C
Operating Temperature-Min
-65 °C
Package Body Material
PLASTIC/EPOXY
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Power Dissipation-Max
0.3 W
Qualification Status
Not Qualified
Rep Pk Reverse Voltage-Max
50 V
Reverse Current-Max
0.1 µA
Reverse Test Voltage
50 V
Surface Mount
YES
Technology
POSITIVE-INTRINSIC-NEGATIVE
Terminal Finish
TIN
Terminal Form
GULL WING
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Want to compare parts?
  1. BAP70AM,135
    NXP Semiconductors
    BAP70AM - Silicon PIN diode array TSSOP 6-Pin
    VS

Alternate Parts for BAP70AM,135

This table gives cross-reference parts and alternative options found for BAP70AM,135. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BAP70AM,135, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
BAP70AM DIODE SILICON, PIN DIODE, PLASTIC, SC-88, 6 PIN, PIN Diode NXP Semiconductors BAP70AM,135 vs BAP70AM
Part Number Description Manufacturer Compare
BAP70AM DIODE SILICON, PIN DIODE, PLASTIC, SC-88, 6 PIN, PIN Diode NXP Semiconductors BAP70AM,135 vs BAP70AM

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