Part Details for BR25L010FV-WE2 by ROHM Semiconductor
Overview of BR25L010FV-WE2 by ROHM Semiconductor
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for BR25L010FV-WE2
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
BR25L010FV-WE2-ND
|
DigiKey | IC EEPROM 1KBIT SPI 5MHZ 8SSOPB Min Qty: 2500 Lead time: 12 Weeks Container: Tape & Reel (TR) | Limited Supply - Call |
|
$0.5778 | Buy Now |
DISTI #
755-BR25L010FV-WE2
|
Mouser Electronics | EEPROM SPI 1K BIT RoHS: Compliant | 0 |
|
Order Now | |
|
Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 2500 Package Multiple: 2500 Container: Reel | 0Reel |
|
$0.3200 | Buy Now |
|
CoreStaff Co Ltd | RoHS(Ship within 1day) - D/C | 46 |
|
$0.3790 / $0.5760 | Buy Now |
Part Details for BR25L010FV-WE2
BR25L010FV-WE2 CAD Models
BR25L010FV-WE2 Part Data Attributes
|
BR25L010FV-WE2
ROHM Semiconductor
Buy Now
Datasheet
|
Compare Parts:
BR25L010FV-WE2
ROHM Semiconductor
EEPROM, 128X8, Serial, CMOS, PDSO8, ROHS COMPLIANT, SSOP-8
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ROHM CO LTD | |
Part Package Code | SOIC | |
Package Description | LSSOP, TSSOP8,.25 | |
Pin Count | 8 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Clock Frequency-Max (fCLK) | 5 MHz | |
Data Retention Time-Min | 40 | |
Endurance | 1000000 Write/Erase Cycles | |
JESD-30 Code | R-PDSO-G8 | |
JESD-609 Code | e2 | |
Length | 4.4 mm | |
Memory Density | 1024 bit | |
Memory IC Type | EEPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Number of Words | 128 words | |
Number of Words Code | 128 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 128X8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LSSOP | |
Package Equivalence Code | TSSOP8,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | |
Parallel/Serial | SERIAL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.25 mm | |
Serial Bus Type | SPI | |
Standby Current-Max | 0.000002 A | |
Supply Current-Max | 0.003 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 1.8 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Copper (Sn/Cu) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 3 mm | |
Write Cycle Time-Max (tWC) | 5 ms | |
Write Protection | HARDWARE |
Alternate Parts for BR25L010FV-WE2
This table gives cross-reference parts and alternative options found for BR25L010FV-WE2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BR25L010FV-WE2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
BR25L010FVT-WE2 | EEPROM, 128X8, Serial, CMOS, PDSO8, ROHS COMPLIANT, TSSOP-8 | ROHM Semiconductor | BR25L010FV-WE2 vs BR25L010FVT-WE2 |