Part Details for BR25L040FVJ-WE2 by ROHM Semiconductor
Overview of BR25L040FVJ-WE2 by ROHM Semiconductor
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for BR25L040FVJ-WE2
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
BR25L040FVJ-WE2CT-ND
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DigiKey | IC EEPROM 4KBIT SPI 5MHZ 8TSSOP Min Qty: 1 Lead time: 11 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) | Limited Supply - Call |
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$0.5891 / $0.8800 | Buy Now |
DISTI #
755-BR25L040FVJ-WE2
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Mouser Electronics | EEPROM SPI 512X8 BIT RoHS: Compliant | 0 |
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Order Now | |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 2500 Package Multiple: 2500 Lead time: 11 Weeks Container: Reel | 0Reel |
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$0.3420 | Buy Now |
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Bristol Electronics | 2500 |
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RFQ | ||
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Quest Components | 2000 |
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$0.4970 / $1.4200 | Buy Now | |
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CoreStaff Co Ltd | RoHS(Ship within 1day) - D/C | 50 |
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$0.2770 / $0.2980 | Buy Now |
Part Details for BR25L040FVJ-WE2
BR25L040FVJ-WE2 CAD Models
BR25L040FVJ-WE2 Part Data Attributes
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BR25L040FVJ-WE2
ROHM Semiconductor
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Datasheet
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BR25L040FVJ-WE2
ROHM Semiconductor
EEPROM, 512X8, Serial, CMOS, PDSO8, ROHS COMPLIANT, TSSOP-8
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ROHM CO LTD | |
Part Package Code | SOIC | |
Package Description | TSSOP, TSSOP8,.19 | |
Pin Count | 8 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Samacsys Manufacturer | ROHM Semiconductor | |
Clock Frequency-Max (fCLK) | 5 MHz | |
Data Retention Time-Min | 40 | |
Endurance | 1000000 Write/Erase Cycles | |
JESD-30 Code | S-PDSO-G8 | |
JESD-609 Code | e2 | |
Length | 3 mm | |
Memory Density | 4096 bit | |
Memory IC Type | EEPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Number of Words | 512 words | |
Number of Words Code | 512 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 512X8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP8,.19 | |
Package Shape | SQUARE | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Parallel/Serial | SERIAL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.05 mm | |
Serial Bus Type | SPI | |
Standby Current-Max | 0.000002 A | |
Supply Current-Max | 0.003 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 1.8 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Copper (Sn/Cu) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 3 mm | |
Write Cycle Time-Max (tWC) | 5 ms | |
Write Protection | HARDWARE |