Part Details for CY7C1062G30-10BGXI by Cypress Semiconductor
Overview of CY7C1062G30-10BGXI by Cypress Semiconductor
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- Number of FFF Equivalents:
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- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
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Price & Stock for CY7C1062G30-10BGXI
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
27AC2843
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Newark | Sram, 16Mbit, 512K X 32Bit, 10Ns, Bga119, Memory Size:16Mbit, Sram Memory Configuration:512K X 32Bit, Supply Voltage Range:2.2V To 3.6V, Memory Case Style:Bga, No. Of Pins:119Pins, Access Time:10Ns, Operating Temperature Min:-40°C, Rohs Compliant: Yes |Cypress Infineon Technologies CY7C1062G30-10BGXI Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 50 |
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$44.1700 / $57.1900 | Buy Now |
DISTI #
84Y4794
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Newark | Async Srams/Tray |Cypress Infineon Technologies CY7C1062G30-10BGXI Min Qty: 168 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$47.1900 | Buy Now |
Part Details for CY7C1062G30-10BGXI
CY7C1062G30-10BGXI CAD Models
CY7C1062G30-10BGXI Part Data Attributes
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CY7C1062G30-10BGXI
Cypress Semiconductor
Buy Now
Datasheet
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CY7C1062G30-10BGXI
Cypress Semiconductor
Standard SRAM, 512KX32, 10ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, PLASTIC, BGA-119
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
Package Description | 14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, PLASTIC, BGA-119 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 10 ns | |
JESD-30 Code | R-PBGA-B119 | |
JESD-609 Code | e1 | |
Length | 22 mm | |
Memory Density | 16777216 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 32 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 119 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 512KX32 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 2.4 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.2 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 14 mm |
Alternate Parts for CY7C1062G30-10BGXI
This table gives cross-reference parts and alternative options found for CY7C1062G30-10BGXI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1062G30-10BGXI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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CY7C1062DV33-10BGI | Standard SRAM, 512KX32, 10ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 | Cypress Semiconductor | CY7C1062G30-10BGXI vs CY7C1062DV33-10BGI |
CY7C1062AV33-10BGI | Standard SRAM, 512KX32, 10ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 | Cypress Semiconductor | CY7C1062G30-10BGXI vs CY7C1062AV33-10BGI |
CY7C1062DV33-10BGXI | Standard SRAM, 512KX32, 10ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, PLASTIC, BGA-119 | Cypress Semiconductor | CY7C1062G30-10BGXI vs CY7C1062DV33-10BGXI |
CY7C1062G30-10BGXI | Standard SRAM, 512KX32, 10ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, PLASTIC, BGA-119 | Infineon Technologies AG | CY7C1062G30-10BGXI vs CY7C1062G30-10BGXI |