Datasheets
CY7C1062G30-10BGXI by:

Standard SRAM, 512KX32, 10ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, PLASTIC, BGA-119

Part Details for CY7C1062G30-10BGXI by Cypress Semiconductor

Overview of CY7C1062G30-10BGXI by Cypress Semiconductor

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Price & Stock for CY7C1062G30-10BGXI

Part # Distributor Description Stock Price Buy
DISTI # 27AC2843
Newark Sram, 16Mbit, 512K X 32Bit, 10Ns, Bga119, Memory Size:16Mbit, Sram Memory Configuration:512K X 32Bit, Supply Voltage Range:2.2V To 3.6V, Memory Case Style:Bga, No. Of Pins:119Pins, Access Time:10Ns, Operating Temperature Min:-40°C, Rohs Compliant: Yes |Cypress Infineon Technologies CY7C1062G30-10BGXI Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk 50
  • 1 $57.1900
  • 5 $55.1700
  • 10 $53.1500
  • 25 $50.4600
  • 50 $44.2200
  • 100 $44.1700
$44.1700 / $57.1900 Buy Now
DISTI # 84Y4794
Newark Async Srams/Tray |Cypress Infineon Technologies CY7C1062G30-10BGXI Min Qty: 168 Package Multiple: 1 Date Code: 0 Container: Bulk 0
  • 100 $47.1900
$47.1900 Buy Now

Part Details for CY7C1062G30-10BGXI

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CY7C1062G30-10BGXI Part Data Attributes

CY7C1062G30-10BGXI Cypress Semiconductor
Buy Now Datasheet
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CY7C1062G30-10BGXI Cypress Semiconductor Standard SRAM, 512KX32, 10ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, PLASTIC, BGA-119
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP
Package Description 14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, PLASTIC, BGA-119
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 10 ns
JESD-30 Code R-PBGA-B119
JESD-609 Code e1
Length 22 mm
Memory Density 16777216 bit
Memory IC Type STANDARD SRAM
Memory Width 32
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 119
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 512KX32
Package Body Material PLASTIC/EPOXY
Package Code HBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, HEAT SINK/SLUG
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Seated Height-Max 2.4 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.2 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 14 mm

Alternate Parts for CY7C1062G30-10BGXI

This table gives cross-reference parts and alternative options found for CY7C1062G30-10BGXI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1062G30-10BGXI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
CY7C1062DV33-10BGI Standard SRAM, 512KX32, 10ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 Cypress Semiconductor CY7C1062G30-10BGXI vs CY7C1062DV33-10BGI
CY7C1062AV33-10BGI Standard SRAM, 512KX32, 10ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 Cypress Semiconductor CY7C1062G30-10BGXI vs CY7C1062AV33-10BGI
CY7C1062DV33-10BGXI Standard SRAM, 512KX32, 10ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, PLASTIC, BGA-119 Cypress Semiconductor CY7C1062G30-10BGXI vs CY7C1062DV33-10BGXI
CY7C1062G30-10BGXI Standard SRAM, 512KX32, 10ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, PLASTIC, BGA-119 Infineon Technologies AG CY7C1062G30-10BGXI vs CY7C1062G30-10BGXI

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