Part Details for CY7C1163KV18-550BZC by Infineon Technologies AG
Overview of CY7C1163KV18-550BZC by Infineon Technologies AG
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for CY7C1163KV18-550BZC
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
CY7C1163KV18-550BZC-ND
|
DigiKey | IC SRAM 18MBIT PAR 165FBGA Min Qty: 136 Lead time: 11 Weeks Container: Tray | Temporarily Out of Stock |
|
$53.3116 | Buy Now |
DISTI #
CY7C1163KV18-550BZC
|
Avnet Americas | SRAM Chip Sync Dual 1.8V 18M-Bit 1M x 18 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C1163KV18-550BZC) RoHS: Not Compliant Min Qty: 136 Package Multiple: 136 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
|
$61.0545 | Buy Now |
DISTI #
727-7C1163KV18550BZC
|
Mouser Electronics | SRAM 18MB (1Mx18) 1.8v 550MHz DDR II SRAM RoHS: Not Compliant | 0 |
|
$51.7600 | Order Now |
DISTI #
CY7C1163KV18-550BZC
|
Avnet Americas | SRAM Chip Sync Dual 1.8V 18M-Bit 1M x 18 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C1163KV18-550BZC) RoHS: Not Compliant Min Qty: 136 Package Multiple: 136 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
|
$61.0545 | Buy Now |
DISTI #
CY7C1163KV18-550BZC
|
Avnet Americas | SRAM Chip Sync Dual 1.8V 18M-Bit 1M x 18 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C1163KV18-550BZC) RoHS: Not Compliant Min Qty: 136 Package Multiple: 136 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
|
$61.0545 | Buy Now |
Part Details for CY7C1163KV18-550BZC
CY7C1163KV18-550BZC CAD Models
CY7C1163KV18-550BZC Part Data Attributes
|
CY7C1163KV18-550BZC
Infineon Technologies AG
Buy Now
Datasheet
|
Compare Parts:
CY7C1163KV18-550BZC
Infineon Technologies AG
QDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, FBGA-165
|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | FBGA-165 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 11 Weeks | |
Access Time-Max | 0.45 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 550 MHz | |
I/O Type | SEPARATE | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e0 | |
Length | 15 mm | |
Memory Density | 18874368 bit | |
Memory IC Type | QDR SRAM | |
Memory Width | 18 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 1048576 words | |
Number of Words Code | 1000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 1MX18 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA165,11X15,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Standby Current-Max | 0.34 A | |
Standby Voltage-Min | 1.7 V | |
Supply Current-Max | 0.78 mA | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 13 mm |
Alternate Parts for CY7C1163KV18-550BZC
This table gives cross-reference parts and alternative options found for CY7C1163KV18-550BZC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1163KV18-550BZC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
IS61NVP25618A-200TQI | 256KX18 ZBT SRAM, 3.1ns, PQFP100, TQFP-100 | Integrated Silicon Solution Inc | CY7C1163KV18-550BZC vs IS61NVP25618A-200TQI |
GS8161E36DGT-333V | Cache SRAM, 512KX36, 5ns, CMOS, PQFP100, TQFP-100 | GSI Technology | CY7C1163KV18-550BZC vs GS8161E36DGT-333V |
K7M163645A-FI130 | ZBT SRAM, 512KX36, CMOS, PBGA165, FBGA-165 | Samsung Semiconductor | CY7C1163KV18-550BZC vs K7M163645A-FI130 |
GS8161E36DD-333IV | Cache SRAM, 512KX36, 5ns, CMOS, PBGA165, FPBGA-165 | GSI Technology | CY7C1163KV18-550BZC vs GS8161E36DD-333IV |
CY7C2263KV18-550BZXI | QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Infineon Technologies AG | CY7C1163KV18-550BZC vs CY7C2263KV18-550BZXI |
GS832136AGD-333IVT | Cache SRAM, 1MX36, 5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165 | GSI Technology | CY7C1163KV18-550BZC vs GS832136AGD-333IVT |
CY7C1163KV18-400BZI | QDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, FBGA-165 | Infineon Technologies AG | CY7C1163KV18-550BZC vs CY7C1163KV18-400BZI |
GS8161E36DGD-150V | Cache SRAM, 512KX36, 7.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165 | GSI Technology | CY7C1163KV18-550BZC vs GS8161E36DGD-150V |
GS8162Z18DD-200IV | ZBT SRAM, 1MX18, 6.5ns, CMOS, PBGA165, FPBGA-165 | GSI Technology | CY7C1163KV18-550BZC vs GS8162Z18DD-200IV |
GS8161E36DGD-200VT | Cache SRAM, 512KX36, 6.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165 | GSI Technology | CY7C1163KV18-550BZC vs GS8161E36DGD-200VT |