Part Details for CY7C1370D-200AXI by Cypress Semiconductor
Overview of CY7C1370D-200AXI by Cypress Semiconductor
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for CY7C1370D-200AXI
Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | CY7C1370D-200AXIJK ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 41 |
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$29.0100 / $34.1300 | Buy Now |
Part Details for CY7C1370D-200AXI
CY7C1370D-200AXI CAD Models
CY7C1370D-200AXI Part Data Attributes:
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CY7C1370D-200AXI
Cypress Semiconductor
Buy Now
Datasheet
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Compare Parts:
CY7C1370D-200AXI
Cypress Semiconductor
ZBT SRAM, 512KX36, 3ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
Part Package Code | QFP | |
Package Description | 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100 | |
Pin Count | 100 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 3 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 200 MHz | |
I/O Type | COMMON | |
JESD-30 Code | R-PQFP-G100 | |
JESD-609 Code | e3 | |
Length | 20 mm | |
Memory Density | 18874368 bit | |
Memory IC Type | ZBT SRAM | |
Memory Width | 36 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 100 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 512KX36 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LQFP | |
Package Equivalence Code | QFP100,.63X.87 | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.6 mm | |
Standby Current-Max | 0.07 A | |
Standby Voltage-Min | 3.14 V | |
Supply Current-Max | 0.3 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3.135 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 14 mm |
Alternate Parts for CY7C1370D-200AXI
This table gives cross-reference parts and alternative options found for CY7C1370D-200AXI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1370D-200AXI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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71V2556XS100BGI8 | ZBT SRAM, 128KX36, CMOS, PBGA119, BGA-119 | Integrated Device Technology Inc | CY7C1370D-200AXI vs 71V2556XS100BGI8 |
CY7C1145KV18-450BZXC | QDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | CY7C1370D-200AXI vs CY7C1145KV18-450BZXC |
CY7C2268KV18-550BZC | DDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Infineon Technologies AG | CY7C1370D-200AXI vs CY7C2268KV18-550BZC |
R1Q3A3636ABG-33R | 1MX36 QDR SRAM, PBGA165, 15 X 17 MM, 1 MM PITCH, PLASTIC, LBGA-165 | Renesas Electronics Corporation | CY7C1370D-200AXI vs R1Q3A3636ABG-33R |
GS841E18AI-133I | Cache Tag SRAM, 256KX18, 11ns, CMOS, PBGA119, FBGA-119 | GSI Technology | CY7C1370D-200AXI vs GS841E18AI-133I |
GS8161E36DGD-333I | Cache SRAM, 512KX36, 4.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165 | GSI Technology | CY7C1370D-200AXI vs GS8161E36DGD-333I |
GS8161E36DGD-150 | Cache SRAM, 512KX36, 7.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165 | GSI Technology | CY7C1370D-200AXI vs GS8161E36DGD-150 |
IDT71V2548XS133PF | ZBT SRAM, 256KX18, 4.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100 | Integrated Device Technology Inc | CY7C1370D-200AXI vs IDT71V2548XS133PF |
IDT71V2548S100B | ZBT SRAM, 256KX18, 5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-028AA, BGA-119 | Integrated Device Technology Inc | CY7C1370D-200AXI vs IDT71V2548S100B |
GS8162Z18DD-150IVT | ZBT SRAM, 1MX18, 7.5ns, CMOS, PBGA165, FPBGA-165 | GSI Technology | CY7C1370D-200AXI vs GS8162Z18DD-150IVT |