Part Details for CY7C1460KV25-200BZXI by Infineon Technologies AG
Overview of CY7C1460KV25-200BZXI by Infineon Technologies AG
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for CY7C1460KV25-200BZXI
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
CY7C1460KV25-200BZXI-ND
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DigiKey | IC SRAM 36MBIT PARALLEL 165FBGA Min Qty: 105 Lead time: 11 Weeks Container: Tray | Limited Supply - Call |
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$56.0185 | Buy Now |
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DISTI #
CY7C1460KV25-200BZXI
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Avnet Americas | SRAM Chip Sync Quad 2.5V 36M-Bit 1M x 36 3.2ns 165-Pin FBGA Tray - Trays (Alt: CY7C1460KV25-200BZXI) RoHS: Compliant Min Qty: 105 Package Multiple: 105 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
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$57.9460 / $70.3630 | Buy Now |
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Future Electronics | SRAM - Synchronous, SDR Memory IC 36Mb (1M x 36) Parallel 200MHz 3.2ns 165-FBGA RoHS: Compliant pbFree: Yes Min Qty: 105 Package Multiple: 105 Container: Tray | 0Tray |
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$70.3700 | Buy Now |
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DISTI #
CY7C1460KV25-200BZXI
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Avnet Americas | SRAM Chip Sync Quad 2.5V 36M-Bit 1M x 36 3.2ns 165-Pin FBGA Tray - Trays (Alt: CY7C1460KV25-200BZXI) RoHS: Compliant Min Qty: 105 Package Multiple: 105 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
|
$57.9460 / $70.3630 | Buy Now |
|
DISTI #
CY7C1460KV25-200BZXI
|
Avnet Americas | SRAM Chip Sync Quad 2.5V 36M-Bit 1M x 36 3.2ns 165-Pin FBGA Tray - Trays (Alt: CY7C1460KV25-200BZXI) RoHS: Compliant Min Qty: 105 Package Multiple: 105 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
|
$57.9460 / $70.3630 | Buy Now |
Part Details for CY7C1460KV25-200BZXI
CY7C1460KV25-200BZXI CAD Models
CY7C1460KV25-200BZXI Part Data Attributes
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CY7C1460KV25-200BZXI
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CY7C1460KV25-200BZXI
Infineon Technologies AG
ZBT SRAM, 1MX36, CMOS, PBGA165, FBGA-165
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| Rohs Code | Yes | |
| Part Life Cycle Code | End Of Life | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | FBGA-165 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 11 Weeks | |
| Samacsys Manufacturer | Infineon | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Memory Density | 37748736 bit | |
| Memory IC Type | ZBT SRAM | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1MX36 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max (Vsup) | 2.625 V | |
| Supply Voltage-Min (Vsup) | 2.375 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 15 mm |