Part Details for CY7C1612KV18-250BZXI by Infineon Technologies AG
Overview of CY7C1612KV18-250BZXI by Infineon Technologies AG
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- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for CY7C1612KV18-250BZXI
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
CY7C1612KV18-250BZXI-ND
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DigiKey | IC SRAM 144MBIT PAR 165FBGA Min Qty: 1 Lead time: 11 Weeks Container: Tray |
53 In Stock |
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$239.0575 / $253.1400 | Buy Now |
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DISTI #
CY7C1612KV18-250BZXI
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Avnet Americas | SRAM Chip Sync Dual 1.8V 144M-Bit 8M x 18 165-Pin FBGA - Trays (Alt: CY7C1612KV18-250BZXI) RoHS: Compliant Min Qty: 210 Package Multiple: 105 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
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$272.5210 | Buy Now |
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DISTI #
727-1612KV18-250BZXI
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Mouser Electronics | SRAM 144Mb 1.8V 250Mhz 8M x 18 QDR II SRAM RoHS: Compliant | 0 |
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$233.3500 | Order Now |
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Future Electronics | SRAM - Synchronous, QDR II Memory IC 144Mbit Parallel 250 MHz 165-FBGA (15x17) RoHS: Compliant pbFree: Yes Min Qty: 210 Package Multiple: 210 Container: Tray | 0Tray |
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$219.7800 | Buy Now |
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DISTI #
CY7C1612KV18-250BZXI
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Avnet Americas | SRAM Chip Sync Dual 1.8V 144M-Bit 8M x 18 165-Pin FBGA - Trays (Alt: CY7C1612KV18-250BZXI) RoHS: Compliant Min Qty: 210 Package Multiple: 105 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
|
$272.5210 | Buy Now |
|
DISTI #
CY7C1612KV18-250BZXI
|
Avnet Americas | SRAM Chip Sync Dual 1.8V 144M-Bit 8M x 18 165-Pin FBGA - Trays (Alt: CY7C1612KV18-250BZXI) RoHS: Compliant Min Qty: 210 Package Multiple: 105 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
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$272.5210 | Buy Now |
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DISTI #
SP005660717
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EBV Elektronik | SRAM Chip Sync Dual 1.8V 144M-Bit 8M x 18 165-Pin FBGA (Alt: SP005660717) RoHS: Compliant Min Qty: 210 Package Multiple: 210 Lead time: 1 Weeks, 5 Days | EBV - 0 |
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Buy Now |
Part Details for CY7C1612KV18-250BZXI
CY7C1612KV18-250BZXI CAD Models
CY7C1612KV18-250BZXI Part Data Attributes
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CY7C1612KV18-250BZXI
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CY7C1612KV18-250BZXI
Infineon Technologies AG
QDR II SRAM, 8MX18, 0.45ns, CMOS, PBGA165, FBGA-165
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | FBGA-165 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 11 Weeks | |
| Samacsys Manufacturer | Infineon | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 250 MHz | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Memory Density | 150994944 bit | |
| Memory IC Type | QDR II SRAM | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8MX18 | |
| Output Characteristics | 3-STATE | |
| Output Enable | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Standby Current-Max | 0.37 A | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.8 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 15 mm |
Alternate Parts for CY7C1612KV18-250BZXI
This table gives cross-reference parts and alternative options found for CY7C1612KV18-250BZXI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1612KV18-250BZXI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CY7C1612KV18-250BZXI | QDR SRAM, 8MX18, 0.45ns, CMOS, PBGA165, FBGA-165 | Cypress Semiconductor | CY7C1612KV18-250BZXI vs CY7C1612KV18-250BZXI |
| CY7C1612KV18-250BZI | QDR SRAM, 8MX18, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, FBGA-165 | Cypress Semiconductor | CY7C1612KV18-250BZXI vs CY7C1612KV18-250BZI |
| CY7C1612KV18-250BZC | QDR SRAM, 8MX18, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, FBGA-165 | Cypress Semiconductor | CY7C1612KV18-250BZXI vs CY7C1612KV18-250BZC |
| CY7C1612KV18-250BZXC | QDR SRAM, 8MX18, 0.45ns, CMOS, PBGA165, FBGA-165 | Cypress Semiconductor | CY7C1612KV18-250BZXI vs CY7C1612KV18-250BZXC |