Datasheets
CY7C261-55DMB by:

OTP ROM, 8KX8, 55ns, CMOS, CDIP24, 0.300 INCH, SLIM, CERDIP-24

Part Details for CY7C261-55DMB by Cypress Semiconductor

Overview of CY7C261-55DMB by Cypress Semiconductor

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Available Datasheets

Part # Manufacturer Description Datasheet
27C512-55DM/B Rochester Electronics LLC 27C512 - 512K (64K x 8) CMOS EPROM
AM27C256-55DM/B Rochester Electronics AM27C256 - 256K (32KX8) CMOS EPROM
8655DMBT1B13KLF Amphenol Communications Solutions D-Sub Accessories, Input Output Connectors, 25 way Straight exit full metal hood with rubber grommet, short screws

Price & Stock for CY7C261-55DMB

Part # Distributor Description Stock Price Buy
Quest Components EPROM, 8K x 8, 24 Pin, Ceramic, DIP 1
  • 1 $204.0847
$204.0847 Buy Now

Part Details for CY7C261-55DMB

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CY7C261-55DMB Part Data Attributes

CY7C261-55DMB Cypress Semiconductor
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CY7C261-55DMB Cypress Semiconductor OTP ROM, 8KX8, 55ns, CMOS, CDIP24, 0.300 INCH, SLIM, CERDIP-24
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP
Part Package Code DIP
Package Description 0.300 INCH, SLIM, CERDIP-24
Pin Count 24
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 55 ns
Additional Feature POWER SWITCHED PROM
I/O Type COMMON
JESD-30 Code R-GDIP-T24
JESD-609 Code e0
Length 31.877 mm
Memory Density 65536 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 8192 words
Number of Words Code 8000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 8KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm
Standby Current-Max 0.03 A
Supply Current-Max 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

Alternate Parts for CY7C261-55DMB

This table gives cross-reference parts and alternative options found for CY7C261-55DMB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C261-55DMB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM27S49A/BLA OTP ROM, 8KX8, 55ns, Bipolar, CDIP24, 0.300 INCH, CERAMIC, DIP-24 AMD CY7C261-55DMB vs AM27S49A/BLA
CY7C261-55DI OTP ROM, 8KX8, 55ns, CMOS, CDIP24, 0.300 INCH, SLIM, CERDIP-24 Cypress Semiconductor CY7C261-55DMB vs CY7C261-55DI
N82HS641NB 8KX8 OTPROM, 55ns, PDIP24 Philips Semiconductors CY7C261-55DMB vs N82HS641NB
93Z565ADMQB OTP ROM, 8KX8, 55ns, TTL, CDIP24, CERAMIC, DIP-24 Fairchild Semiconductor Corporation CY7C261-55DMB vs 93Z565ADMQB
5962-9080301MLA OTP ROM, 8KX8, 55ns, CMOS, CDIP24, Teledyne e2v CY7C261-55DMB vs 5962-9080301MLA
N82HS641F OTP ROM, 8KX8, 55ns, Bipolar, CDIP24 Signetics CY7C261-55DMB vs N82HS641F
5962-9080305MLX OTP ROM, 8KX8, 55ns, CMOS, CDIP24 Cypress Semiconductor CY7C261-55DMB vs 5962-9080305MLX
93Z564DC OTP ROM, 8KX8, 55ns, TTL, CDIP24, CERAMIC, DIP-24 Fairchild Semiconductor Corporation CY7C261-55DMB vs 93Z564DC
27HC641-55/SP 8K X 8 OTPROM, 55 ns, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24 Microchip Technology Inc CY7C261-55DMB vs 27HC641-55/SP
N82HS641N IC 8K X 8 OTPROM, 55 ns, PDIP24, Programmable ROM NXP Semiconductors CY7C261-55DMB vs N82HS641N
Part Number Description Manufacturer Compare
CY7C263-25DMB OTP ROM, 8KX8, 25ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 Cypress Semiconductor CY7C261-55DMB vs CY7C263-25DMB
CY7C264-40DI OTP ROM, 8KX8, 40ns, CMOS, CDIP24, 0.300 INCH, SLIM, CERDIP-24 Cypress Semiconductor CY7C261-55DMB vs CY7C264-40DI
CY7C261-40PC OTP ROM, 8KX8, 40ns, CMOS, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 Cypress Semiconductor CY7C261-55DMB vs CY7C261-40PC
AM27S49PC-T OTP ROM, 8KX8, 55ns, Bipolar, PDIP24, 0.300 INCH, PLASTIC, DIP-24 AMD CY7C261-55DMB vs AM27S49PC-T
93Z564DC OTP ROM, 8KX8, 55ns, TTL, CDIP24, CERAMIC, DIP-24 Fairchild Semiconductor Corporation CY7C261-55DMB vs 93Z564DC
27HC641L-45/SP 8K X 8 OTPROM, 45 ns, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24 Microchip Technology Inc CY7C261-55DMB vs 27HC641L-45/SP
CY7C261-20DI OTP ROM, 8KX8, 20ns, CMOS, CDIP24, 0.300 INCH, SLIM, CERDIP-24 Cypress Semiconductor CY7C261-55DMB vs CY7C261-20DI
8200901LC OTP ROM, 8KX8, 100ns, Bipolar, CDIP24, Raytheon Semiconductor CY7C261-55DMB vs 8200901LC
93Z564DMQB OTP ROM, 8KX8, 65ns, TTL, CDIP24, CERAMIC, DIP-24 Fairchild Semiconductor Corporation CY7C261-55DMB vs 93Z564DMQB
CY7C264-25DC OTP ROM, 8KX8, 25ns, CMOS, CDIP24, 0.600 INCH, CERDIP-24 Cypress Semiconductor CY7C261-55DMB vs CY7C264-25DC

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