Part Details for CY7C4141KV13-633FCXI by Infineon Technologies AG
Overview of CY7C4141KV13-633FCXI by Infineon Technologies AG
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for CY7C4141KV13-633FCXI
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
CY7C4141KV13-633FCXI-ND
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DigiKey | IC SRAM 144MBIT PAR 361FCBGA Min Qty: 120 Lead time: 11 Weeks Container: Tray | Temporarily Out of Stock |
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$236.2210 | Buy Now |
DISTI #
CY7C4141KV13-633FC
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Avnet Americas | SRAM Chip Sync Dual 1.3V 144M-bit 4M x 36 10ns 361-Pin FCBGA Tray - Trays (Alt: CY7C4141KV13-633FC) RoHS: Compliant Min Qty: 120 Package Multiple: 60 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
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$248.1640 / $301.3420 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 120 Package Multiple: 120 Container: Tray | 0Tray |
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$221.5800 | Buy Now |
DISTI #
CY7C4141KV13-633FC
|
Avnet Americas | SRAM Chip Sync Dual 1.3V 144M-bit 4M x 36 10ns 361-Pin FCBGA Tray - Trays (Alt: CY7C4141KV13-633FC) RoHS: Compliant Min Qty: 120 Package Multiple: 60 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
|
$248.1640 / $301.3420 | Buy Now |
DISTI #
CY7C4141KV13-633FC
|
Avnet Americas | SRAM Chip Sync Dual 1.3V 144M-bit 4M x 36 10ns 361-Pin FCBGA Tray - Trays (Alt: CY7C4141KV13-633FC) RoHS: Compliant Min Qty: 120 Package Multiple: 60 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
|
$248.1640 / $301.3420 | Buy Now |
Part Details for CY7C4141KV13-633FCXI
CY7C4141KV13-633FCXI CAD Models
CY7C4141KV13-633FCXI Part Data Attributes
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CY7C4141KV13-633FCXI
Infineon Technologies AG
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Datasheet
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CY7C4141KV13-633FCXI
Infineon Technologies AG
QDR SRAM, 4MX36, CMOS, PBGA361, 21 X 21 MM, 2.515 MM HEIGHT, LEAD FREE, FCBGA-361
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | 21 X 21 MM, 2.515 MM HEIGHT, LEAD FREE, FCBGA-361 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 11 Weeks | |
Samacsys Manufacturer | Infineon | |
JESD-30 Code | S-PBGA-B361 | |
JESD-609 Code | e1 | |
Length | 21 mm | |
Memory Density | 150994944 bit | |
Memory IC Type | QDR SRAM | |
Memory Width | 36 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 361 | |
Number of Words | 4194304 words | |
Number of Words Code | 4000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 4MX36 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Seated Height-Max | 2.765 mm | |
Supply Voltage-Max (Vsup) | 1.34 V | |
Supply Voltage-Min (Vsup) | 1.26 V | |
Supply Voltage-Nom (Vsup) | 1.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 21 mm |