Datasheets
CYD09S18V18-200BBXC by:

Dual-Port SRAM, 512KX18, 3.3ns, CMOS, PBGA256, 17 X 17 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256

Part Details for CYD09S18V18-200BBXC by Cypress Semiconductor

Overview of CYD09S18V18-200BBXC by Cypress Semiconductor

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Applications Industrial Automation Energy and Power Systems Renewable Energy

Price & Stock for CYD09S18V18-200BBXC

Part # Distributor Description Stock Price Buy
Rochester Electronics Dual-Port SRAM, 512KX18, 3.3ns PBGA256 RoHS: Compliant Status: Obsolete Min Qty: 1 339
  • 1 $127.1700
  • 25 $124.6300
  • 100 $119.5400
  • 500 $114.4500
  • 1,000 $108.1000
$108.1000 / $127.1700 Buy Now

Part Details for CYD09S18V18-200BBXC

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CYD09S18V18-200BBXC Part Data Attributes

CYD09S18V18-200BBXC Cypress Semiconductor
Buy Now Datasheet
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CYD09S18V18-200BBXC Cypress Semiconductor Dual-Port SRAM, 512KX18, 3.3ns, CMOS, PBGA256, 17 X 17 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description 17 X 17 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256
Pin Count 256
Reach Compliance Code unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 3.3 ns
Additional Feature PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
Clock Frequency-Max (fCLK) 200 MHz
I/O Type COMMON
JESD-30 Code S-PBGA-B256
JESD-609 Code e1
Length 17 mm
Memory Density 9437184 bit
Memory IC Type MULTI-PORT SRAM
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Ports 2
Number of Terminals 256
Number of Words 524288 words
Number of Words Code 512000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 512KX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.7 mm
Standby Current-Max 0.2 A
Standby Voltage-Min 1.4 V
Supply Current-Max 0.66 mA
Supply Voltage-Max (Vsup) 1.58 V
Supply Voltage-Min (Vsup) 1.42 V
Supply Voltage-Nom (Vsup) 1.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 17 mm

Alternate Parts for CYD09S18V18-200BBXC

This table gives cross-reference parts and alternative options found for CYD09S18V18-200BBXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CYD09S18V18-200BBXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
CYD09S18V18-200BBI Dual-Port SRAM, 512KX18, 9ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, MO-192, FBGA-256 Cypress Semiconductor CYD09S18V18-200BBXC vs CYD09S18V18-200BBI
CYD09S18V18-200BBXI Dual-Port SRAM, 512KX18, 3.3ns, CMOS, PBGA256, 17 X 17 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 Cypress Semiconductor CYD09S18V18-200BBXC vs CYD09S18V18-200BBXI
CYD09S18V18-200BBC Dual-Port SRAM, 512KX18, 9ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, MO-192, FBGA-256 Cypress Semiconductor CYD09S18V18-200BBXC vs CYD09S18V18-200BBC
Part Number Description Manufacturer Compare
IDT70T633S15BC Dual-Port SRAM, 512KX18, 15ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 Integrated Device Technology Inc CYD09S18V18-200BBXC vs IDT70T633S15BC
70V7319S2133BCGI Dual-Port SRAM, 256KX18, 4.2ns, CMOS, PBGA256, 17 X 17 MM, 1.4 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256 Integrated Device Technology Inc CYD09S18V18-200BBXC vs 70V7319S2133BCGI
70V7339S133BCI8 512K x 18 Synchronous Bank-Switchable Dual-Port SRAM, CABGA0/Reel Renesas Electronics Corporation CYD09S18V18-200BBXC vs 70V7339S133BCI8
70V7339S133BCI 512K x 18 Synchronous Bank-Switchable Dual-Port SRAM, CABGA90/Tray Renesas Electronics Corporation CYD09S18V18-200BBXC vs 70V7339S133BCI
70V7319S166BC8 CABGA-256, Reel Integrated Device Technology Inc CYD09S18V18-200BBXC vs 70V7319S166BC8
IDT70T3339S133BCG Dual-Port SRAM, 512KX18, 4.2ns, CMOS, CBGA256, 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256 Integrated Device Technology Inc CYD09S18V18-200BBXC vs IDT70T3339S133BCG
IDT70V7339S200BC8 Dual-Port SRAM, 512KX18, 10ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 Integrated Device Technology Inc CYD09S18V18-200BBXC vs IDT70V7339S200BC8
IDT70T3339S166BC Dual-Port SRAM, 512KX18, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 Integrated Device Technology Inc CYD09S18V18-200BBXC vs IDT70T3339S166BC
70V7319S200BC8 CABGA-256, Reel Integrated Device Technology Inc CYD09S18V18-200BBXC vs 70V7319S200BC8
70T3339S133BC8 CABGA-256, Reel Integrated Device Technology Inc CYD09S18V18-200BBXC vs 70T3339S133BC8

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