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Overview of DE5213-350 by LSI Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for DE5213-350 by LSI Corporation
Part Data Attributes for DE5213-350 by LSI Corporation
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|---|---|
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Rohs Code
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No
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Part Life Cycle Code
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Obsolete
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Ihs Manufacturer
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SEEQ TECHNOLOGY INC
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Package Description
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DIP, DIP24,.6
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Reach Compliance Code
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unknown
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ECCN Code
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EAR99
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HTS Code
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8542.32.00.51
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Access Time-Max
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350 ns
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Command User Interface
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NO
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Data Polling
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NO
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JESD-30 Code
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R-XDIP-T24
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JESD-609 Code
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e0
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Memory Density
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16384 bit
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Memory IC Type
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EEPROM
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Memory Width
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8
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Number of Terminals
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24
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Number of Words
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2048 words
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Number of Words Code
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2000
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Operating Temperature-Max
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85 °C
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Operating Temperature-Min
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-40 °C
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Organization
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2KX8
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Package Body Material
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CERAMIC
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Package Code
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DIP
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Package Equivalence Code
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DIP24,.6
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Package Shape
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RECTANGULAR
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Package Style
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IN-LINE
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Parallel/Serial
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PARALLEL
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Qualification Status
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Not Qualified
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Supply Voltage-Nom (Vsup)
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5 V
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Surface Mount
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NO
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Technology
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MOS
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Temperature Grade
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INDUSTRIAL
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Terminal Finish
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Tin/Lead (Sn/Pb)
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Terminal Form
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THROUGH-HOLE
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Terminal Pitch
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2.54 mm
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Terminal Position
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DUAL
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Toggle Bit
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NO
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