Datasheets
DM54S474AJ by:

IC 512 X 8 OTPROM, 60 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM

Part Details for DM54S474AJ by National Semiconductor Corporation

Overview of DM54S474AJ by National Semiconductor Corporation

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Part Details for DM54S474AJ

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DM54S474AJ Part Data Attributes

DM54S474AJ National Semiconductor Corporation
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DM54S474AJ National Semiconductor Corporation IC 512 X 8 OTPROM, 60 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP
Package Description DIP, DIP24,.6
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 60 ns
JESD-30 Code R-GDIP-T24
JESD-609 Code e0
Memory Density 4096 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 512 words
Number of Words Code 512
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 512X8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 4.572 mm
Supply Current-Max 0.17 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology BIPOLAR
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for DM54S474AJ

This table gives cross-reference parts and alternative options found for DM54S474AJ. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DM54S474AJ, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
N82S215I OTP ROM, 512X8, 60ns, Bipolar, CDIP24, Signetics DM54S474AJ vs N82S215I
N82S115N OTP ROM, 512X8, 60ns, Bipolar, PDIP24, YAGEO Corporation DM54S474AJ vs N82S115N
DM54S474AJ 512X8 OTPROM, 60ns, CDIP24, CERAMIC, DIP-24 Texas Instruments DM54S474AJ vs DM54S474AJ
N82S115NB 512X8 OTPROM, 60ns, PDIP24 Philips Semiconductors DM54S474AJ vs N82S115NB
AM27S15PCB OTP ROM, 512X8, 60ns, Bipolar, PDIP24, PLASTIC, DIP-24 AMD DM54S474AJ vs AM27S15PCB
AM27S15PC OTP ROM, 512X8, 60ns, Bipolar, PDIP24, PLASTIC, DIP-24 AMD DM54S474AJ vs AM27S15PC
N82S215I IC 512 X 8 OTPROM, 60 ns, CDIP24, Programmable ROM NXP Semiconductors DM54S474AJ vs N82S215I
N82S115NB OTP ROM, 512X8, 60ns, Bipolar, PDIP24, Signetics DM54S474AJ vs N82S115NB
Part Number Description Manufacturer Compare
DM87SR476BN IC 512 X 8 OTPROM, PDIP24, PLASTIC, DIP-24, Programmable ROM Texas Instruments DM54S474AJ vs DM87SR476BN
CY7C225A-30LMB OTP ROM, 512X8, 15ns, CMOS, CQCC28, LCC-28 Cypress Semiconductor DM54S474AJ vs CY7C225A-30LMB
5341-2J883B OTP ROM, 512X8, 70ns, CMOS, CDIP24, Monolithic Memories (RETIRED) DM54S474AJ vs 5341-2J883B
CY7C225-25LI OTP ROM, 512X8, 12ns, CMOS, CQCC28, CERAMIC, LCC-28 Cypress Semiconductor DM54S474AJ vs CY7C225-25LI
AM27S25/BLA OTP ROM, 512X8, Bipolar, CDIP24, 0.300 INCH, CERAMIC, DIP-24 Rochester Electronics LLC DM54S474AJ vs AM27S25/BLA
82S115/BJA OTP ROM, 512X8, 90ns, Bipolar, CDIP24, YAGEO Corporation DM54S474AJ vs 82S115/BJA
DM74S474AN IC 512 X 8 OTPROM, 45 ns, PDIP24, PLASTIC, DIP-24, Programmable ROM Texas Instruments DM54S474AJ vs DM74S474AN
5962-8851805LX OTP ROM, 512X8, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24 Cypress Semiconductor DM54S474AJ vs 5962-8851805LX
AM27S25DMB OTP ROM Rochester Electronics LLC DM54S474AJ vs AM27S25DMB
N82S141AN OTP ROM, 512X8, 45ns, Bipolar, PDIP24, YAGEO Corporation DM54S474AJ vs N82S141AN

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