Part Details for DS2502X1+ by Maxim Integrated Products
Overview of DS2502X1+ by Maxim Integrated Products
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Education and Research
Security and Surveillance
Financial Technology (Fintech)
Computing and Data Storage
Energy and Power Systems
Price & Stock for DS2502X1+
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
DS2502X1+-ND
|
DigiKey | IC EPROM 1KBIT 1-WIRE 4WLP Lead time: 29 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
|
Buy Now | |
|
|
Bristol Electronics | 326 |
|
RFQ |
Part Details for DS2502X1+
DS2502X1+ CAD Models
DS2502X1+ Part Data Attributes
|
|
DS2502X1+
Maxim Integrated Products
Buy Now
Datasheet
|
Compare Parts:
DS2502X1+
Maxim Integrated Products
OTP ROM, 128X8, 15000ns, CMOS, PBGA2, ROHS COMPLIANT, CSP
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MAXIM INTEGRATED PRODUCTS INC | |
| Part Package Code | BGA | |
| Package Description | VBGA, BGA4,2X2,37/16 | |
| Pin Count | 2 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Access Time-Max | 15000 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B2 | |
| JESD-609 Code | e2 | |
| Length | 1.6 mm | |
| Memory Density | 1024 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 2 | |
| Number of Words | 128 words | |
| Number of Words Code | 128 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128X8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VBGA | |
| Package Equivalence Code | BGA4,2X2,37/16 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 0.639 mm | |
| Supply Voltage-Max (Vsup) | 6 V | |
| Supply Voltage-Min (Vsup) | 2.8 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER NICKEL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.933 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 0.91 mm |
Alternate Parts for DS2502X1+
This table gives cross-reference parts and alternative options found for DS2502X1+. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DS2502X1+, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| DS2502X1 | OTP ROM, 128X8, 15000ns, CMOS, PBGA2, CSP-2 | Maxim Integrated Products | DS2502X1+ vs DS2502X1 |
| DS2502X1#U | OTP ROM, 128X8, CMOS, PBGA2, CSP-2 | Maxim Integrated Products | DS2502X1+ vs DS2502X1#U |