Datasheets
EDFP164A3PD-JD-F-D by: Micron Technology Inc

DDR DRAM,

Part Details for EDFP164A3PD-JD-F-D by Micron Technology Inc

Overview of EDFP164A3PD-JD-F-D by Micron Technology Inc

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Available Datasheets

Part # Manufacturer Description Datasheet
DBL5W5P543A40LF Amphenol Communications Solutions D-Sub Power Board Mount Connectors, Input Output Connectors, Full Power 5W5 Pin Right Angle Solder 40A, Europe Standard, 500 Cycles, Front: Threaded Insert M3, Back: Without Accessory on PCB.
DEL2V2P543H40LF Amphenol Communications Solutions D-Sub Power Board Mount Connectors, Input Output Connectors, Full Power 2V2 Pin Right Angle Solder 40A, Europe Standard, 500 Cycles, Front: Threaded Insert M3, Back: Harpoons for 2.4mm PCB Thickness.
DC8W8P500H30LF Amphenol Communications Solutions D-Sub Power Board Mount Connectors, Input Output Connectors, Full Power 8W8 Pin Right Angle Solder 30A, Europe Standard, 200 Cycles, Front: Without Accessory, Back: Harpoons for 2.4mm PCB Thickness.

Price & Stock for EDFP164A3PD-JD-F-D

Part # Distributor Description Stock Price Buy
DISTI # EDFP164A3PD-JD-F-D
Avnet Americas DRAM Chip Mobile LPDDR3 SDRAM 24G-Bit 384Mx64 1.2V 256-Pin VFBGA Tray - Bulk (Alt: EDFP164A3PD-JD-F-D) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 18 Weeks, 0 Days Container: Bulk 0
RFQ
DISTI # EDFP164A3PD-JD-F-D
Avnet Silica (Alt: EDFP164A3PD-JD-F-D) RoHS: Compliant Min Qty: 1260 Package Multiple: 1260 Lead time: 13 Weeks, 0 Days Silica - 0
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Part Details for EDFP164A3PD-JD-F-D

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EDFP164A3PD-JD-F-D Part Data Attributes

EDFP164A3PD-JD-F-D Micron Technology Inc
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EDFP164A3PD-JD-F-D Micron Technology Inc DDR DRAM,
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Package Description VFBGA,
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.36
Factory Lead Time 18 Weeks
Samacsys Manufacturer Micron
Access Mode DUAL BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
JESD-30 Code S-PBGA-B256
Length 14 mm
Memory Density 25769803776 bit
Memory IC Type DDR DRAM
Memory Width 64
Number of Functions 1
Number of Ports 1
Number of Terminals 256
Number of Words 402653184 words
Number of Words Code 384000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -30 °C
Organization 384MX64
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Shape SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 0.8 mm
Self Refresh YES
Supply Voltage-Max (Vsup) 1.3 V
Supply Voltage-Min (Vsup) 1.14 V
Supply Voltage-Nom (Vsup) 1.2 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Form BALL
Terminal Pitch 0.4 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm

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