Part Details for GE28F008B3BA90 by Rochester Electronics LLC
Overview of GE28F008B3BA90 by Rochester Electronics LLC
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- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for GE28F008B3BA90
GE28F008B3BA90 CAD Models
GE28F008B3BA90 Part Data Attributes
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GE28F008B3BA90
Rochester Electronics LLC
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Datasheet
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GE28F008B3BA90
Rochester Electronics LLC
1M X 8 FLASH 2.7V PROM, 90 ns, PBGA46, VFBGA-46
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ROCHESTER ELECTRONICS INC | |
Part Package Code | BGA | |
Package Description | VFBGA, | |
Pin Count | 46 | |
Reach Compliance Code | unknown | |
Access Time-Max | 90 ns | |
Additional Feature | BOTTOM BOOT BLOCK | |
JESD-30 Code | R-PBGA-B46 | |
JESD-609 Code | e0 | |
Length | 7.91 mm | |
Memory Density | 8388608 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Moisture Sensitivity Level | NOT SPECIFIED | |
Number of Functions | 1 | |
Number of Terminals | 46 | |
Number of Words | 1048576 words | |
Number of Words Code | 1000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 1MX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Programming Voltage | 2.7 V | |
Qualification Status | COMMERCIAL | |
Seated Height-Max | 1 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 0.75 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 6.5 mm |