Part Details for GS8662D06BD-350I by GSI Technology
Overview of GS8662D06BD-350I by GSI Technology
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Price & Stock for GS8662D06BD-350I
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
GS8662D06BD-350I
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Avnet Americas | SRAM Chip Sync Dual 1.8V 72M-Bit 8M x 8 0.45ns 165-Pin FBGA Bulk - Bulk (Alt: GS8662D06BD-350I) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk | 0 |
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$76.7016 / $94.4460 | Buy Now |
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DISTI #
464-GS8662D06BD-350I
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Mouser Electronics | SRAM 1.8 or 1.5V 8M x 8 64M | 0 |
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$75.2000 / $89.7200 | Order Now |
|
DISTI #
GS8662D06BD-350I
|
Avnet Americas | SRAM Chip Sync Dual 1.8V 72M-Bit 8M x 8 0.45ns 165-Pin FBGA Bulk - Bulk (Alt: GS8662D06BD-350I) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk | 0 |
|
$76.7016 / $94.4460 | Buy Now |
Part Details for GS8662D06BD-350I
GS8662D06BD-350I CAD Models
GS8662D06BD-350I Part Data Attributes:
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GS8662D06BD-350I
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS8662D06BD-350I
GSI Technology
QDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 165 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.B | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 24 Weeks | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| JESD-30 Code | R-PBGA-B165 | |
| Length | 15 mm | |
| Memory Density | 67108864 bit | |
| Memory IC Type | QDR SRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8MX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 13 mm |
Alternate Parts for GS8662D06BD-350I
This table gives cross-reference parts and alternative options found for GS8662D06BD-350I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662D06BD-350I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CY7C1516V18-300BZI | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | GS8662D06BD-350I vs CY7C1516V18-300BZI |
| CY7C1561KV18-550BZXC | QDR SRAM, 8MX8, 0.29ns, CMOS, PBGA165, 15 X 13 MM, 1.4 MM HEIGHT, FBGA-165 | Cypress Semiconductor | GS8662D06BD-350I vs CY7C1561KV18-550BZXC |
| GS8662Q08BGD-357T | QDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662D06BD-350I vs GS8662Q08BGD-357T |
| CY7C1517V18-167BZI | DDR SRAM, 8MX8, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | GS8662D06BD-350I vs CY7C1517V18-167BZI |
| GS8662TT07BD-400 | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662D06BD-350I vs GS8662TT07BD-400 |
| CY7C1510JV18-267BZC | QDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | GS8662D06BD-350I vs CY7C1510JV18-267BZC |
| GS8662T08BD-333T | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662D06BD-350I vs GS8662T08BD-333T |
| GS8662T08BD-250 | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662D06BD-350I vs GS8662T08BD-250 |
| GS8662T06BD-500T | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, FBGA-165 | GSI Technology | GS8662D06BD-350I vs GS8662T06BD-500T |
| GS8662T06BD-450 | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662D06BD-350I vs GS8662T06BD-450 |