Part Details for GS8662DT20BGD-500I by GSI Technology
Overview of GS8662DT20BGD-500I by GSI Technology
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- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Price & Stock for GS8662DT20BGD-500I
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
2364-GS8662DT20BGD-500I-ND
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DigiKey | IC SRAM 72MBIT PARALLEL 165FPBGA Min Qty: 15 Lead time: 26 Weeks Container: Tray | Temporarily Out of Stock |
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$122.1240 | Buy Now |
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DISTI #
GS8662DT20BGD-500I
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Avnet Americas | SRAM Chip Sync Dual 1.8V 72M-Bit 4M x 18 0.45ns 165-Pin FBGA - Bulk (Alt: GS8662DT20BGD-500I) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk | 0 |
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$105.6456 / $130.0860 | Buy Now |
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DISTI #
464-8662DT20BGD500I
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Mouser Electronics | SRAM 1.8 or 1.5V 4M x 18 72M RoHS: Compliant | 0 |
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$116.6100 / $118.5700 | Order Now |
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DISTI #
GS8662DT20BGD-500I
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Avnet Americas | SRAM Chip Sync Dual 1.8V 72M-Bit 4M x 18 0.45ns 165-Pin FBGA - Bulk (Alt: GS8662DT20BGD-500I) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk | 0 |
|
$105.6456 / $130.0860 | Buy Now |
|
DISTI #
GS8662DT20BGD-500I
|
Avnet Americas | SRAM Chip Sync Dual 1.8V 72M-Bit 4M x 18 0.45ns 165-Pin FBGA - Bulk (Alt: GS8662DT20BGD-500I) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk | 0 |
|
$105.6456 / $130.0860 | Buy Now |
|
DISTI #
GS8662DT20BGD-500I
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Avnet Silica | SRAM Chip Sync Dual 1.8V 72M-Bit 4M x 18 0.45ns 165-Pin FBGA (Alt: GS8662DT20BGD-500I) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 3 Weeks, 6 Days | Silica - 0 |
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Buy Now |
Part Details for GS8662DT20BGD-500I
GS8662DT20BGD-500I CAD Models
GS8662DT20BGD-500I Part Data Attributes
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GS8662DT20BGD-500I
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS8662DT20BGD-500I
GSI Technology
QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 165 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.B | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 24 Weeks | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| JESD-30 Code | R-PBGA-B165 | |
| Length | 15 mm | |
| Memory Density | 75497472 bit | |
| Memory IC Type | QDR SRAM | |
| Memory Width | 18 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 4194304 words | |
| Number of Words Code | 4000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 4MX18 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 13 mm |
Alternate Parts for GS8662DT20BGD-500I
This table gives cross-reference parts and alternative options found for GS8662DT20BGD-500I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662DT20BGD-500I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| GS8662D19BD-300I | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662DT20BGD-500I vs GS8662D19BD-300I |
| CY7C1410V18-200BZC | QDR SRAM, 4MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165 | Cypress Semiconductor | GS8662DT20BGD-500I vs CY7C1410V18-200BZC |
| CY7C1513JV18-250BZXC | QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | GS8662DT20BGD-500I vs CY7C1513JV18-250BZXC |
| CY7C1665KV18-550BZXC | QDR SRAM, 4MX36, 0.45ns, CMOS, PBGA165, FBGA-165 | Infineon Technologies AG | GS8662DT20BGD-500I vs CY7C1665KV18-550BZXC |
| GS8672D19BE-375T | Standard SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662DT20BGD-500I vs GS8672D19BE-375T |
| GS8662DT19BGD-450 | QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662DT20BGD-500I vs GS8662DT19BGD-450 |
| IS61QDP2B24M18A-300M3 | QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165 | Integrated Silicon Solution Inc | GS8662DT20BGD-500I vs IS61QDP2B24M18A-300M3 |
| IS61DDP2B24M18A-500M3I | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165 | Integrated Silicon Solution Inc | GS8662DT20BGD-500I vs IS61DDP2B24M18A-500M3I |
| IS61DDB44M18A-300B4I | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LFBGA-165 | Integrated Silicon Solution Inc | GS8662DT20BGD-500I vs IS61DDB44M18A-300B4I |
| CY7C1523JV18-300BZXC | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | GS8662DT20BGD-500I vs CY7C1523JV18-300BZXC |