Part Details for H5AN8G8NDJR-XNC by SK Hynix Inc
Overview of H5AN8G8NDJR-XNC by SK Hynix Inc
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Applications
Consumer Electronics
Computing and Data Storage
Part Details for H5AN8G8NDJR-XNC
H5AN8G8NDJR-XNC CAD Models
H5AN8G8NDJR-XNC Part Data Attributes:
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H5AN8G8NDJR-XNC
SK Hynix Inc
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Datasheet
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H5AN8G8NDJR-XNC
SK Hynix Inc
DDR4 DRAM, 1GX8, CMOS, PBGA78, FBGA-78
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Rohs Code | Yes | |
Part Life Cycle Code | End Of Life | |
Ihs Manufacturer | SK HYNIX INC | |
Package Description | FBGA-78 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.36 | |
Access Mode | MULTI BANK PAGE BURST | |
Additional Feature | AUTO/SELF REFRESH | |
Clock Frequency-Max (fCLK) | 1600 MHz | |
I/O Type | COMMON | |
Interleaved Burst Length | 4,8 | |
JESD-30 Code | R-PBGA-B78 | |
Length | 11 mm | |
Memory Density | 8589934592 bit | |
Memory IC Type | DDR4 DRAM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 78 | |
Number of Words | 1073741824 words | |
Number of Words Code | 1000000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 1GX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA78,9X13,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Seated Height-Max | 1.2 mm | |
Self Refresh | YES | |
Sequential Burst Length | 4,8 | |
Standby Current-Max | 0.033 A | |
Supply Current-Max | 0.05 mA | |
Supply Voltage-Max (Vsup) | 1.26 V | |
Supply Voltage-Min (Vsup) | 1.14 V | |
Supply Voltage-Nom (Vsup) | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 7.5 mm |