Part Details for H5DU1262GTR-E3C by SK Hynix Inc
Overview of H5DU1262GTR-E3C by SK Hynix Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Security and Surveillance
Audio and Video Systems
Transportation and Logistics
Renewable Energy
Automotive
Robotics and Drones
Price & Stock for H5DU1262GTR-E3C
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 96 |
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RFQ | ||
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Quest Components | DDR DRAM, 8MX16, 0.7NS, CMOS, PDSO66 | 27 |
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$3.0000 / $6.0000 | Buy Now |
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Quest Components | DDR DRAM, 8MX16, 0.7NS, CMOS, PDSO66 | 76 |
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$3.7000 / $6.0000 | Buy Now |
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Quest Components | DDR DRAM, 8MX16, 0.7NS, CMOS, PDSO66 | 352 |
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$4.9500 / $9.0000 | Buy Now |
Part Details for H5DU1262GTR-E3C
H5DU1262GTR-E3C CAD Models
H5DU1262GTR-E3C Part Data Attributes:
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H5DU1262GTR-E3C
SK Hynix Inc
Buy Now
Datasheet
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Compare Parts:
H5DU1262GTR-E3C
SK Hynix Inc
DDR DRAM, 8MX16, 0.7ns, CMOS, PDSO66
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SK HYNIX INC | |
| Package Description | TSSOP, TSSOP66,.46 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.02 | |
| Access Time-Max | 0.7 ns | |
| Clock Frequency-Max (fCLK) | 200 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 2,4,8 | |
| JESD-30 Code | R-PDSO-G66 | |
| JESD-609 Code | e6 | |
| Memory Density | 134217728 bit | |
| Memory IC Type | DDR1 DRAM | |
| Memory Width | 16 | |
| Number of Terminals | 66 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 8MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP66,.46 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 4096 | |
| Sequential Burst Length | 2,4,8 | |
| Standby Current-Max | 0.01 A | |
| Supply Current-Max | 0.3 mA | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN BISMUTH | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.635 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 20 |