Part Details for H5DU2562GTR-E3C by SK Hynix Inc
Overview of H5DU2562GTR-E3C by SK Hynix Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (2 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for H5DU2562GTR-E3C
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 50 |
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RFQ | ||
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Quest Components | 16M X 16 DDR DRAM, 0.7 ns, PDSO66 | 40 |
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$5.8520 / $8.7780 | Buy Now |
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Chip1Cloud | DRAM Chip DDR SDRAM 256Mbit 16Mx16 2.5V 66-Pin TSOP-II | 10500 |
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RFQ | |
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Component Electronics, Inc | IN STOCK SHIP TODAY | 40 |
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$4.0000 / $6.1500 | Buy Now |
Part Details for H5DU2562GTR-E3C
H5DU2562GTR-E3C CAD Models
H5DU2562GTR-E3C Part Data Attributes:
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H5DU2562GTR-E3C
SK Hynix Inc
Buy Now
Datasheet
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Compare Parts:
H5DU2562GTR-E3C
SK Hynix Inc
DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SK HYNIX INC | |
Part Package Code | TSOP2 | |
Package Description | 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 | |
Pin Count | 66 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.24 | |
Access Mode | FOUR BANK PAGE BURST | |
Access Time-Max | 0.7 ns | |
Additional Feature | AUTO/SELF REFRESH | |
Clock Frequency-Max (fCLK) | 200 MHz | |
I/O Type | COMMON | |
Interleaved Burst Length | 2,4,8 | |
JESD-30 Code | R-PDSO-G66 | |
JESD-609 Code | e6 | |
Length | 22.225 mm | |
Memory Density | 268435456 bit | |
Memory IC Type | DDR1 DRAM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 66 | |
Number of Words | 16777216 words | |
Number of Words Code | 16000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 16MX16 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP66,.46 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Refresh Cycles | 8192 | |
Seated Height-Max | 1.194 mm | |
Self Refresh | YES | |
Sequential Burst Length | 2,4,8 | |
Standby Current-Max | 0.004 A | |
Supply Current-Max | 0.21 mA | |
Supply Voltage-Max (Vsup) | 2.7 V | |
Supply Voltage-Min (Vsup) | 2.3 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN BISMUTH | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 20 | |
Width | 10.155 mm |
Alternate Parts for H5DU2562GTR-E3C
This table gives cross-reference parts and alternative options found for H5DU2562GTR-E3C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of H5DU2562GTR-E3C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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H5DU2562GTR-E3L | DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 | SK Hynix Inc | H5DU2562GTR-E3C vs H5DU2562GTR-E3L |
NT5DS16M16DS-5T | DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, TSOP2-66 | Nanya Technology Corporation | H5DU2562GTR-E3C vs NT5DS16M16DS-5T |