-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
DRAM Module, 256MX16, CMOS, PBGA96, FBGA-96
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
H5TC4G63CFR-PBA by SK Hynix Inc is a DRAM.
DRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
|
Vyrian | Memory ICs | 239 |
|
RFQ | |
|
Win Source Electronics | DRAM Chip DDR3L SDRAM 4Gbit 256Mx16 1.35V 96-Pin FBGA | 31589 |
|
$5.0219 / $6.4865 | Buy Now |
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
|
H5TC4G63CFR-PBA
SK Hynix Inc
Buy Now
Datasheet
|
Compare Parts:
H5TC4G63CFR-PBA
SK Hynix Inc
DRAM Module, 256MX16, CMOS, PBGA96, FBGA-96
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SK HYNIX INC | |
Package Description | FBGA-96 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.36 | |
Samacsys Manufacturer | Hynix | |
Access Mode | MULTI BANK PAGE BURST | |
Additional Feature | AUTO/SELF REFRESH | |
JESD-30 Code | R-PBGA-B96 | |
Length | 13 mm | |
Memory Density | 4294967296 bit | |
Memory IC Type | DRAM MODULE | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 96 | |
Number of Words | 268435456 words | |
Number of Words Code | 256000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 256MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.2 mm | |
Self Refresh | YES | |
Supply Voltage-Max (Vsup) | 1.45 V | |
Supply Voltage-Min (Vsup) | 1.283 V | |
Supply Voltage-Nom (Vsup) | 1.35 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 20 | |
Width | 7.5 mm |
This table gives cross-reference parts and alternative options found for H5TC4G63CFR-PBA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of H5TC4G63CFR-PBA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
The maximum operating temperature range for the H5TC4G63CFR-PBA is 0°C to 95°C.
The H5TC4G63CFR-PBA requires a refresh command every 3.9 μs (tREFI) to maintain data integrity. You can use the auto-refresh mode or manual refresh mode, depending on your system requirements.
The minimum clock cycle time (tCK) for the H5TC4G63CFR-PBA is 1.25 ns, which corresponds to a clock frequency of 800 MHz.
The H5TC4G63CFR-PBA requires a specific power-up sequence, including a 200 ms delay after power-on, followed by a reset command. For power-down, you should perform a precharge-all command, then reduce the clock frequency to 0 Hz.
The maximum allowable voltage for the H5TC4G63CFR-PBA is 1.4 V, with a tolerance of ±0.1 V.