Part Details for H5TQ4G63EFR-RDC by SK Hynix Inc
Results Overview of H5TQ4G63EFR-RDC by SK Hynix Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
H5TQ4G63EFR-RDC Information
H5TQ4G63EFR-RDC by SK Hynix Inc is a DRAM.
DRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for H5TQ4G63EFR-RDC
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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LCSC | SDRAM DDR3 FBGA-96 DDR SDRAM ROHS | 630 |
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$1.2882 / $2.1684 | Buy Now |
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Vyrian | Memory ICs | 661 |
|
RFQ | |
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Win Source Electronics | 70000 |
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$0.9667 / $1.2487 | Buy Now |
Part Details for H5TQ4G63EFR-RDC
H5TQ4G63EFR-RDC CAD Models
H5TQ4G63EFR-RDC Part Data Attributes
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H5TQ4G63EFR-RDC
SK Hynix Inc
Buy Now
Datasheet
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H5TQ4G63EFR-RDC
SK Hynix Inc
DDR DRAM,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SK HYNIX INC | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Access Mode | MULTI BANK PAGE BURST | |
| Additional Feature | AUTO/SELF REFRESH | |
| JESD-30 Code | R-PBGA-B96 | |
| Length | 13 mm | |
| Memory Density | 4294967296 bit | |
| Memory IC Type | DDR3 DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 96 | |
| Number of Words | 268435456 words | |
| Number of Words Code | 256000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | ||
| Organization | 256MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 1.575 V | |
| Supply Voltage-Min (Vsup) | 1.425 V | |
| Supply Voltage-Nom (Vsup) | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 7.5 mm |
Alternate Parts for H5TQ4G63EFR-RDC
This table gives cross-reference parts and alternative options found for H5TQ4G63EFR-RDC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of H5TQ4G63EFR-RDC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
H5TQ4G63EFR-RDC Frequently Asked Questions (FAQ)
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The maximum operating temperature range for the H5TQ4G63EFR-RDC is 0°C to 85°C.
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To ensure signal integrity, it is recommended to use a signal integrity analysis tool to simulate the signal transmission and optimize the PCB design. Additionally, using a clock signal with a high slew rate and a low jitter can help improve signal integrity.
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The recommended voltage for the H5TQ4G63EFR-RDC is 1.2V ± 0.06V.
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The H5TQ4G63EFR-RDC requires a refresh command every 64ms to maintain data integrity. The refresh command should be issued during the self-refresh mode to minimize power consumption.
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The maximum current consumption for the H5TQ4G63EFR-RDC is 1.5A during write operations and 1.2A during read operations.