Part Details for IDT6116SA55TDB by Integrated Device Technology Inc
Overview of IDT6116SA55TDB by Integrated Device Technology Inc
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
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Applications
Computing and Data Storage
Financial Technology (Fintech)
Price & Stock for IDT6116SA55TDB
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | Min Qty: 1 | 3 |
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$13.5000 | Buy Now |
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Bristol Electronics | 3 |
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RFQ | ||
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Quest Components | Static RAM, 2Kx8, 24 Pin, Ceramic, DIP | 17 |
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$14.3000 | Buy Now |
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Quest Components | Static RAM, 2Kx8, 24 Pin, Ceramic, DIP | 2 |
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$18.0000 | Buy Now |
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Quest Components | Static RAM, 2Kx8, 24 Pin, Ceramic, DIP | 233 |
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$18.5352 / $23.1690 | Buy Now |
Part Details for IDT6116SA55TDB
IDT6116SA55TDB CAD Models
IDT6116SA55TDB Part Data Attributes
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IDT6116SA55TDB
Integrated Device Technology Inc
Buy Now
Datasheet
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IDT6116SA55TDB
Integrated Device Technology Inc
Standard SRAM, 2KX8, 55ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP24,.3 | |
| Pin Count | 24 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Date Of Intro | 1988-01-01 | |
| Access Time-Max | 55 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T24 | |
| JESD-609 Code | e0 | |
| Length | 32.004 mm | |
| Memory Density | 16384 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 2048 words | |
| Number of Words Code | 2000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 2KX8 | |
| Output Characteristics | 3-STATE | |
| Output Enable | YES | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP24,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 Class B | |
| Seated Height-Max | 5.08 mm | |
| Standby Current-Max | 0.01 A | |
| Standby Voltage-Min | 4.5 V | |
| Supply Current-Max | 0.1 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for IDT6116SA55TDB
This table gives cross-reference parts and alternative options found for IDT6116SA55TDB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IDT6116SA55TDB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 6116LA55TDB | CDIP-24, Tube | Integrated Device Technology Inc | IDT6116SA55TDB vs 6116LA55TDB |
| 6116SA55TDB | CDIP-24, Tube | Integrated Device Technology Inc | IDT6116SA55TDB vs 6116SA55TDB |
| 8403610LA | CDIP-24, Tube | Integrated Device Technology Inc | IDT6116SA55TDB vs 8403610LA |