Memory
IDT7164L35TCB
Integrated Device Technology Inc
Description: Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.300 INCH, THIN, SIDE BRAZED, DIP-28

Overview of IDT7164L35TCB by Integrated Device Technology Inc

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Price & Stock for IDT7164L35TCB by Integrated Device Technology Inc

Part # Manufacturer Description Stock Price Buy
Quest Components Static RAM, 8Kx8, 28 Pin, Ceramic, DIP 2
  • 1 $5.0000
$5.0000 Buy Now
Quest Components Static RAM, 8Kx8, 28 Pin, Ceramic, DIP 2
  • 1 $11.4802
  • 3 $10.7148
$10.7148 / $11.4802 Buy Now
Quest Components Static RAM, 8Kx8, 28 Pin, Ceramic, DIP 2
  • 1 $12.9600
  • 2 $10.8000
  • 3 $9.5040
$9.5040 / $12.9600 Buy Now

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Part Data Attributes for IDT7164L35TCB by Integrated Device Technology Inc

IDT7164L35TCB
Integrated Device Technology Inc
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
DIP
Package Description
0.300 INCH, THIN, SIDE BRAZED, DIP-28
Pin Count
28
Reach Compliance Code
not_compliant
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Access Time-Max
35 ns
I/O Type
COMMON
JESD-30 Code
R-CDIP-T28
JESD-609 Code
e0
Length
35.56 mm
Memory Density
65536 bit
Memory IC Type
STANDARD SRAM
Memory Width
8
Number of Functions
1
Number of Ports
1
Number of Terminals
28
Number of Words
8192 words
Number of Words Code
8000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
8KX8
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
Package Equivalence Code
DIP28,.3
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
5.08 mm
Standby Current-Max
0.0002 A
Standby Voltage-Min
2 V
Supply Current-Max
0.14 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
7.62 mm
Want to compare parts?
  1. IDT7164L35TCB
    Integrated Device Technology Inc
    Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.300 INCH, THIN, SIDE BRAZED, DIP-28
    VS

Alternate Parts for IDT7164L35TCB

This table gives cross-reference parts and alternative options found for IDT7164L35TCB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IDT7164L35TCB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
FT6164-35CM Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, SIDE BRAZED, DIP-28 Force Technologies Ltd IDT7164L35TCB vs FT6164-35CM
5962-3829413MXX Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, CERAMIC, DIP-28 Matra MHS IDT7164L35TCB vs 5962-3829413MXX
5962-3829454MZX Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, CERAMIC, DIP-28 Pyramid Semiconductor Corporation IDT7164L35TCB vs 5962-3829454MZX
P4C164-35DMB Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 Pyramid Semiconductor Corporation IDT7164L35TCB vs P4C164-35DMB
CY7C186-35DMB Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, Cypress Semiconductor IDT7164L35TCB vs CY7C186-35DMB
5962-8552508XA Standard SRAM, 8KX8, 35ns, CMOS, CDIP28 Intel Corporation IDT7164L35TCB vs 5962-8552508XA
P4C164L-35CWCLF Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, ROHS COMPLIANT, CERAMIC, SIDE BRAZED, DIP-28 Pyramid Semiconductor Corporation IDT7164L35TCB vs P4C164L-35CWCLF
FT6164L-35CMLF Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.300 INCH, ROHS COMPLIANT, CERAMIC, SIDE BRAZED, DIP-28 Force Technologies Ltd IDT7164L35TCB vs FT6164L-35CMLF
P4C164L-35CMLF Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.300 INCH, ROHS COMPLIANT, CERAMIC, SIDE BRAZED, DIP-28 Pyramid Semiconductor Corporation IDT7164L35TCB vs P4C164L-35CMLF
FT6264-35DM Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 Force Technologies Ltd IDT7164L35TCB vs FT6264-35DM
Part Number Description Manufacturer Compare
WS128K32-45HSME SRAM Module, 512KX8, 45ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 White Electronic Designs Corp IDT7164L35TCB vs WS128K32-45HSME
CY7C194-35LC Standard SRAM, 64KX4, 35ns, CMOS, LCC-28 Cypress Semiconductor IDT7164L35TCB vs CY7C194-35LC
SMDP-65656L45 Standard SRAM, 32KX8, CMOS, CDFP28, Temic Semiconductors IDT7164L35TCB vs SMDP-65656L45
FT6264-45PCLF Standard SRAM, 8KX8, 45ns, CMOS, PDIP28, 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-28 Force Technologies Ltd IDT7164L35TCB vs FT6264-45PCLF
FT6198A-20DC Standard SRAM, 16KX4, 20ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 Force Technologies Ltd IDT7164L35TCB vs FT6198A-20DC
WS128K32V-20G4S SRAM Module, 512KX8, 20ns, CMOS, White Electronic Designs Corp IDT7164L35TCB vs WS128K32V-20G4S
WS128K32-20G4I SRAM Module, 512KX8, 20ns, CMOS, CQFP68, 40 MM, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp IDT7164L35TCB vs WS128K32-20G4I
MB8287-35PSK Standard SRAM, 32KX8, 35ns, CMOS, PDIP32, 0.300 INCH, SKINNY, PLASTIC, DIP-32 FUJITSU Semiconductor Limited IDT7164L35TCB vs MB8287-35PSK
WS128K32-45G2IA SRAM Module, 512KX8, 45ns, CMOS, CQFP68, 22 X 22 MM, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp IDT7164L35TCB vs WS128K32-45G2IA
IMS1820W-35 64KX4 STANDARD SRAM, 35ns, CQCC28, CERAMIC, LCC-28 STMicroelectronics IDT7164L35TCB vs IMS1820W-35

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