Part Details for IM2G08D2DBBG-25 by Intelligent Memory Limited
Overview of IM2G08D2DBBG-25 by Intelligent Memory Limited
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Internet of Things (IoT)
Industrial Automation
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Electronic Manufacturing
Automotive
Price & Stock for IM2G08D2DBBG-25
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
5107-IM2G08D2DBBG-25-ND
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DigiKey | DDR2 2GB, 1.8V, 256MX8, 400MHZ ( Min Qty: 1 Lead time: 26 Weeks Container: Tray |
50 In Stock |
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$9.0753 / $12.5900 | Buy Now |
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DISTI #
822-IM2G08D2DBBG-25
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Mouser Electronics | DRAM DDR2 2Gb, 1.8V, 256Mx8, 400MHz (800Mbps), 0C to +95C, FBGA-60 RoHS: Compliant | 449 |
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$9.1100 / $12.2100 | Buy Now |
Part Details for IM2G08D2DBBG-25
IM2G08D2DBBG-25 CAD Models
IM2G08D2DBBG-25 Part Data Attributes
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IM2G08D2DBBG-25
Intelligent Memory Limited
Buy Now
Datasheet
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Compare Parts:
IM2G08D2DBBG-25
Intelligent Memory Limited
DDR DRAM, 256MX8, CMOS, PBGA60, GREEN, FPBGA-60
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| Rohs Code | Yes | |
| Part Life Cycle Code | Contact Manufacturer | |
| Ihs Manufacturer | I'M INTELLIGENT MEMORY LTD | |
| Package Description | TFBGA, | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Access Mode | MULTI BANK PAGE BURST | |
| Additional Feature | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | |
| JESD-30 Code | R-PBGA-B60 | |
| Length | 11.5 mm | |
| Memory Density | 2147483648 bit | |
| Memory IC Type | DDR DRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 60 | |
| Number of Words | 268435456 words | |
| Number of Words Code | 256000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 256MX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 10.5 mm |