Part Details for IS22ES32G-JCLA1 by Integrated Silicon Solution Inc
Overview of IS22ES32G-JCLA1 by Integrated Silicon Solution Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Space Technology
Environmental Monitoring
Internet of Things (IoT)
Smart Cities
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Consumer Electronics
Education and Research
Security and Surveillance
Aerospace and Defense
Healthcare
Robotics and Drones
Price & Stock for IS22ES32G-JCLA1
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
IS22ES32G-JCLA1
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Avnet Silica | NAND Flash Memory with eMMC 5.0 Interface 32GB 0-200MHz Automotive Grade -40 to 85�C 153-Ball FBGA (Alt: IS22ES32G-JCLA1) RoHS: Compliant Min Qty: 152 Package Multiple: 152 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Part Details for IS22ES32G-JCLA1
IS22ES32G-JCLA1 CAD Models
IS22ES32G-JCLA1 Part Data Attributes
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IS22ES32G-JCLA1
Integrated Silicon Solution Inc
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Datasheet
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IS22ES32G-JCLA1
Integrated Silicon Solution Inc
Flash, 32GX8, PBGA153, FBGA-153
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | VFBGA, BGA153,14X14,20 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Date Of Intro | 2016-09-13 | |
| Alternate Memory Width | 1 | |
| Clock Frequency-Max (fCLK) | 200 MHz | |
| Command User Interface | NO | |
| Data Polling | NO | |
| JESD-30 Code | R-PBGA-B153 | |
| JESD-609 Code | e1 | |
| Length | 13 mm | |
| Memory Density | 274877906944 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 153 | |
| Number of Words | 34359738368 words | |
| Number of Words Code | 32000000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32GX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA153,14X14,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programming Voltage | 3.3 V | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 10 | |
| Toggle Bit | NO | |
| Type | MLC NAND TYPE | |
| Width | 11.5 mm |