Part Details for IS22TF32G-JCLA1 by Integrated Silicon Solution Inc
Overview of IS22TF32G-JCLA1 by Integrated Silicon Solution Inc
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Renewable Energy
Automotive
Price & Stock for IS22TF32G-JCLA1
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
47AK0339
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Newark | 32Gb, 153 Ball Fbga, 3.3V, Rohs, Auto Grade (-40+85C) |Integrated Silicon Solution (Issi) IS22TF32G-JCLA1 Min Qty: 152 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$35.2400 | Buy Now |
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DISTI #
706-IS22TF32G-JCLA1-ND
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DigiKey | IC FLASH 256GBIT EMMC 153VFBGA Min Qty: 152 Lead time: 8 Weeks Container: Bulk | Temporarily Out of Stock |
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$27.8384 | Buy Now |
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DISTI #
IS22TF32G-JCLA1
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Avnet Americas | 32GB, 153 BALL FBGA, 3.3V, ROHS, AUTO GRADE (-40+85C) - Trays (Alt: IS22TF32G-JCLA1) RoHS: Not Compliant Min Qty: 152 Package Multiple: 152 Lead time: 10 Weeks, 0 Days Container: Tray | 0 |
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$33.6250 / $41.1570 | Buy Now |
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DISTI #
870-IS22TF32G-JCLA1
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Mouser Electronics | eMMC 32GB, 153 Ball FBGA, 3.3V, RoHS, Auto Grade (-40+85C) RoHS: Compliant | 0 |
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$36.3500 | Order Now |
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DISTI #
IS22TF32G-JCLA1
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Avnet Americas | 32GB, 153 BALL FBGA, 3.3V, ROHS, AUTO GRADE (-40+85C) - Trays (Alt: IS22TF32G-JCLA1) RoHS: Not Compliant Min Qty: 152 Package Multiple: 152 Lead time: 10 Weeks, 0 Days Container: Tray | 0 |
|
$33.6250 / $41.1570 | Buy Now |
Part Details for IS22TF32G-JCLA1
IS22TF32G-JCLA1 CAD Models
IS22TF32G-JCLA1 Part Data Attributes:
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IS22TF32G-JCLA1
Integrated Silicon Solution Inc
Buy Now
Datasheet
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Compare Parts:
IS22TF32G-JCLA1
Integrated Silicon Solution Inc
Flash, 32GX8, PBGA153, FBGA-153
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | FBGA-153 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 10 Weeks | |
| Clock Frequency-Max (fCLK) | 200 MHz | |
| JESD-30 Code | R-PBGA-B153 | |
| Length | 13 mm | |
| Memory Density | 274877906944 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 153 | |
| Number of Words | 34359738368 words | |
| Number of Words Code | 32000000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32GX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA153,14X14,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 3.3 V | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1 mm | |
| Standby Current-Max | 0.00003 A | |
| Supply Current-Max | 0.055 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Type | TLC NAND TYPE | |
| Width | 11.5 mm | |
| Write Protection | HARDWARE/SOFTWARE |