Part Details for IS43DR16640C-3DBLI by Integrated Silicon Solution Inc
Overview of IS43DR16640C-3DBLI by Integrated Silicon Solution Inc
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for IS43DR16640C-3DBLI
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
74Y9257
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Newark | 1G, 1.8V, Ddr2, 64Mx16, 333Mhz @ Cl5, 84 Ball Bga (8Mm X 12.5Mm) Rohs, It |Integrated Silicon Solution (Issi) IS43DR16640C-3DBLI Min Qty: 209 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$3.8500 / $4.7600 | Buy Now |
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DISTI #
706-1565-ND
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DigiKey | IC DRAM 1GBIT PARALLEL 84TWBGA Min Qty: 1 Lead time: 6 Weeks Container: Tray |
1200 In Stock |
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$3.7455 / $5.2500 | Buy Now |
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DISTI #
IS43DR16640C-3DBLI
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Avnet Americas | DRAM Chip DDR2 SDRAM 1G-Bit 64Mx16 1.8V 84-Pin TWBGA - Trays (Alt: IS43DR16640C-3DBLI) RoHS: Compliant Min Qty: 209 Package Multiple: 1 Lead time: 8 Weeks, 0 Days Container: Tray | 0 |
|
$3.5375 / $4.3299 | Buy Now |
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DISTI #
870-43DR16640C-3DBLI
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Mouser Electronics | DRAM DDR2,1G,1.8V, RoHs 333MHz,64Mx16, IT RoHS: Compliant | 333 |
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$3.7400 / $5.2500 | Buy Now |
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Bristol Electronics | 25 |
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RFQ | ||
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DISTI #
IS43DR16640C-3DBLI
|
Avnet Americas | DRAM Chip DDR2 SDRAM 1G-Bit 64Mx16 1.8V 84-Pin TWBGA - Trays (Alt: IS43DR16640C-3DBLI) RoHS: Compliant Min Qty: 209 Package Multiple: 1 Lead time: 6 Weeks, 0 Days Container: Tray | 418 |
|
$3.5375 / $4.3299 | Buy Now |
|
DISTI #
IS43DR16640C-3DBLI
|
Avnet Americas | DRAM Chip DDR2 SDRAM 1G-Bit 64Mx16 1.8V 84-Pin TWBGA - Trays (Alt: IS43DR16640C-3DBLI) RoHS: Compliant Min Qty: 209 Package Multiple: 1 Lead time: 8 Weeks, 0 Days Container: Tray | 0 |
|
$3.5375 / $4.3299 | Buy Now |
|
DISTI #
IS43DR16640C-3DBLI
|
Avnet Americas | DRAM Chip DDR2 SDRAM 1G-Bit 64Mx16 1.8V 84-Pin TWBGA - Trays (Alt: IS43DR16640C-3DBLI) RoHS: Compliant Min Qty: 209 Package Multiple: 1 Lead time: 6 Weeks, 0 Days Container: Tray | 418 |
|
$3.5375 / $4.3299 | Buy Now |
|
DISTI #
IS43DR16640C-3DBLI
|
Avnet Americas | DRAM Chip DDR2 SDRAM 1G-Bit 64Mx16 1.8V 84-Pin TWBGA - Trays (Alt: IS43DR16640C-3DBLI) RoHS: Compliant Min Qty: 209 Package Multiple: 1 Lead time: 8 Weeks, 0 Days Container: Tray | 0 |
|
$3.5375 / $4.3299 | Buy Now |
|
DISTI #
IS43DR16640C-3DBLI
|
Avnet Asia | DRAM Chip DDR2 SDRAM 1G-Bit 64Mx16 1.8V 84-Pin TWBGA (Alt: IS43DR16640C-3DBLI) RoHS: Compliant Min Qty: 209 Package Multiple: 209 Lead time: 12 Weeks, 0 Days | 0 |
|
RFQ |
Part Details for IS43DR16640C-3DBLI
IS43DR16640C-3DBLI CAD Models
IS43DR16640C-3DBLI Part Data Attributes
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IS43DR16640C-3DBLI
Integrated Silicon Solution Inc
Buy Now
Datasheet
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Compare Parts:
IS43DR16640C-3DBLI
Integrated Silicon Solution Inc
DDR DRAM, 64MX16, 0.45ns, CMOS, PBGA84, TWBGA-84
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | TFBGA, BGA84,9X15,32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.32 | |
| Factory Lead Time | 8 Weeks | |
| Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
| Access Mode | MULTI BANK PAGE BURST | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 333 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 4,8 | |
| JESD-30 Code | R-PBGA-B84 | |
| JESD-609 Code | e1 | |
| Length | 12.5 mm | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | DDR2 DRAM | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 84 | |
| Number of Words | 67108864 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA84,9X15,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 4,8 | |
| Standby Current-Max | 0.025 A | |
| Supply Current-Max | 0.27 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 8 mm |
Alternate Parts for IS43DR16640C-3DBLI
This table gives cross-reference parts and alternative options found for IS43DR16640C-3DBLI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IS43DR16640C-3DBLI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IS43DR16640C-3DBL | DDR DRAM, 64MX16, 0.45ns, CMOS, PBGA84, TWBGA-84 | Integrated Silicon Solution Inc | IS43DR16640C-3DBLI vs IS43DR16640C-3DBL |
| IS43DR16640C-3DBLA2 | DDR DRAM, 64MX16, 0.45ns, CMOS, PBGA84, 8 X 12.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, TWBGA-84 | Integrated Silicon Solution Inc | IS43DR16640C-3DBLI vs IS43DR16640C-3DBLA2 |