Part Details for IS43LD16640C-18BLI by Integrated Silicon Solution Inc
Overview of IS43LD16640C-18BLI by Integrated Silicon Solution Inc
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Price & Stock for IS43LD16640C-18BLI
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
13AC5143
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Newark | 1G, 1.2/1.8V, Lpddr2, 64Mx16, 533Mhz, 134 Ball Bga (10Mm X 11.5Mm) Rohs, It |Integrated Silicon Solution (Issi) IS43LD16640C-18BLI Min Qty: 171 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$7.5400 / $8.9200 | Buy Now |
|
DISTI #
IS43LD16640C-18BLI-ND
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DigiKey | IC DRAM 1GBIT PARALLEL 134TFBGA Min Qty: 171 Lead time: 10 Weeks Container: Tray | Temporarily Out of Stock |
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$7.6514 | Buy Now |
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DISTI #
IS43LD16640C-18BLI
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Avnet Americas | Mobile LPDDR2 S4 SDRAM 1Gb 64Mx16 533MHz -18ns 134-Pin FBGA Tray - Trays (Alt: IS43LD16640C-18BLI) RoHS: Compliant Min Qty: 171 Package Multiple: 171 Lead time: 10 Weeks, 0 Days Container: Tray | 0 |
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$6.9250 / $8.4762 | Buy Now |
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DISTI #
870-43LD16640C18BLI
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Mouser Electronics | DRAM 1G, 1.2/1.8V, LPDDR2, 64Mx16, 533MHz, 134 ball BGA (10mmx11.5mm) RoHS, IT RoHS: Compliant | 0 |
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$7.4800 / $7.8200 | Order Now |
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DISTI #
IS43LD16640C-18BLI
|
Avnet Americas | Mobile LPDDR2 S4 SDRAM 1Gb 64Mx16 533MHz -18ns 134-Pin FBGA Tray - Trays (Alt: IS43LD16640C-18BLI) RoHS: Compliant Min Qty: 171 Package Multiple: 171 Lead time: 10 Weeks, 0 Days Container: Tray | 0 |
|
$6.9250 / $8.4762 | Buy Now |
|
DISTI #
IS43LD16640C-18BLI
|
Avnet Americas | Mobile LPDDR2 S4 SDRAM 1Gb 64Mx16 533MHz -18ns 134-Pin FBGA Tray - Trays (Alt: IS43LD16640C-18BLI) RoHS: Compliant Min Qty: 171 Package Multiple: 171 Lead time: 10 Weeks, 0 Days Container: Tray | 0 |
|
$6.9250 / $8.4762 | Buy Now |
|
DISTI #
IS43LD16640C-18BLI
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Avnet Silica | Mobile LPDDR2 S4 SDRAM 1Gb 64Mx16 533MHz -18ns 134-Pin FBGA Tray (Alt: IS43LD16640C-18BLI) RoHS: Compliant Min Qty: 171 Package Multiple: 171 Lead time: 2 Weeks, 0 Days | Silica - 0 |
|
Buy Now |
Part Details for IS43LD16640C-18BLI
IS43LD16640C-18BLI CAD Models
IS43LD16640C-18BLI Part Data Attributes
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IS43LD16640C-18BLI
Integrated Silicon Solution Inc
Buy Now
Datasheet
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IS43LD16640C-18BLI
Integrated Silicon Solution Inc
DDR DRAM, 64MX16, CMOS, PBGA134, FBGA-134
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | TFBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.32 | |
| Factory Lead Time | 10 Weeks | |
| Date Of Intro | 2016-03-14 | |
| Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
| Access Mode | MULTI BANK PAGE BURST | |
| Additional Feature | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | |
| JESD-30 Code | R-PBGA-B134 | |
| JESD-609 Code | e1 | |
| Length | 11.5 mm | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | LPDDR2 DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 134 | |
| Number of Words | 67108864 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.1 mm | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 1.3 V | |
| Supply Voltage-Min (Vsup) | 1.14 V | |
| Supply Voltage-Nom (Vsup) | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 10 | |
| Width | 10 mm |