Part Details for IS43LD16640C-25BLI by Integrated Silicon Solution Inc
Overview of IS43LD16640C-25BLI by Integrated Silicon Solution Inc
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for IS43LD16640C-25BLI
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
65AC6015
|
Newark | Sdram, 1Gbit, 400Mhz, Fbga-134, Dram Memory Configuration:64M X 16Bit, Memory Case Style:Fbga, No. Of Pins:134Pins, Ic Interface Type:Parallel, Access Time:-, Page Size:-, Operating Temperature Min:-40°C, Operating Temperature Rohs Compliant: Yes |Integrated Silicon Solution (Issi) IS43LD16640C-25BLI Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$7.5200 / $9.6200 | Buy Now |
DISTI #
706-1591-ND
|
DigiKey | IC DRAM 1GBIT PARALLEL 134TFBGA Min Qty: 1 Lead time: 10 Weeks Container: Tray |
453 In Stock |
|
$6.8389 / $9.5400 | Buy Now |
DISTI #
IS43LD16640C-25BLI
|
Avnet Americas | DRAM Chip Mobile LPDDR2 S4 SDRAM 1G-Bit 64Mx16 1.2V 134-Pin TF-BGA - Bulk (Alt: IS43LD16640C-25BLI) RoHS: Compliant Min Qty: 171 Package Multiple: 171 Lead time: 10 Weeks, 0 Days Container: Bulk | 0 |
|
$6.6000 / $8.0784 | Buy Now |
DISTI #
870-43LD16640C25BLI
|
Mouser Electronics | DRAM 1G 64Mx16 400MHz LPDDR2 1.2/1.8V RoHS: Compliant | 365 |
|
$6.8300 / $9.5400 | Buy Now |
DISTI #
IS43LD16640C-25BLI
|
Avnet Americas | DRAM Chip Mobile LPDDR2 S4 SDRAM 1G-Bit 64Mx16 1.2V 134-Pin TF-BGA - Bulk (Alt: IS43LD16640C-25BLI) RoHS: Compliant Min Qty: 171 Package Multiple: 171 Lead time: 10 Weeks, 0 Days Container: Bulk | 0 |
|
$6.6000 / $8.0784 | Buy Now |
DISTI #
IS43LD16640C-25BLI
|
Avnet Americas | DRAM Chip Mobile LPDDR2 S4 SDRAM 1G-Bit 64Mx16 1.2V 134-Pin TF-BGA - Bulk (Alt: IS43LD16640C-25BLI) RoHS: Compliant Min Qty: 171 Package Multiple: 171 Lead time: 10 Weeks, 0 Days Container: Bulk | 0 |
|
$6.6000 / $8.0784 | Buy Now |
DISTI #
IS43LD16640C-25BLI
|
Avnet Asia | DRAM Chip Mobile LPDDR2 S4 SDRAM 1G-Bit 64Mx16 1.2V 134-Pin TF-BGA (Alt: IS43LD16640C-25BLI) RoHS: Compliant Min Qty: 171 Package Multiple: 171 Lead time: 12 Weeks, 0 Days | 0 |
|
RFQ | |
DISTI #
IS43LD16640C-25BLI
|
Avnet Silica | DRAM Chip Mobile LPDDR2 S4 SDRAM 1G-Bit 64Mx16 1.2V 134-Pin TF-BGA (Alt: IS43LD16640C-25BLI) RoHS: Compliant Min Qty: 171 Package Multiple: 171 Lead time: 2 Weeks, 0 Days | Silica - 1710 |
|
Buy Now | |
DISTI #
2901177
|
element14 Asia-Pacific | SDRAM, 1GBIT, 400MHZ, FBGA-134 RoHS: Compliant Min Qty: 1 Container: Each | 0 |
|
$8.0434 / $9.7094 | Buy Now |
DISTI #
2901177
|
Farnell | SDRAM, 1GBIT, 400MHZ, FBGA-134 RoHS: Compliant Min Qty: 1 Lead time: 15 Weeks, 1 Days Container: Each | 0 |
|
$7.0682 / $9.9404 | Buy Now |
Part Details for IS43LD16640C-25BLI
IS43LD16640C-25BLI CAD Models
IS43LD16640C-25BLI Part Data Attributes
|
IS43LD16640C-25BLI
Integrated Silicon Solution Inc
Buy Now
Datasheet
|
Compare Parts:
IS43LD16640C-25BLI
Integrated Silicon Solution Inc
DDR DRAM, 64MX16, CMOS, PBGA134, FBGA-134
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
Package Description | TFBGA, | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.32 | |
Factory Lead Time | 10 Weeks | |
Date Of Intro | 2016-03-14 | |
Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
Access Mode | MULTI BANK PAGE BURST | |
Additional Feature | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | |
JESD-30 Code | R-PBGA-B134 | |
JESD-609 Code | e1 | |
Length | 11.5 mm | |
Memory Density | 1073741824 bit | |
Memory IC Type | LPDDR2 DRAM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 134 | |
Number of Words | 67108864 words | |
Number of Words Code | 64000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 64MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.1 mm | |
Self Refresh | YES | |
Supply Voltage-Max (Vsup) | 1.3 V | |
Supply Voltage-Min (Vsup) | 1.14 V | |
Supply Voltage-Nom (Vsup) | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.65 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 10 | |
Width | 10 mm |