Part Details for IS43LQ16256EA-062B2LI by Integrated Silicon Solution Inc
Overview of IS43LQ16256EA-062B2LI by Integrated Silicon Solution Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for IS43LQ16256EA-062B2LI
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DISTI #
IS43LQ16256EA-062B2LI
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Avnet Asia | DRAM, Mobile LPDDR4, 4 Gbit, 256M x 16bit, 1.6 GHz, 200 Pins, FBGA (Alt: IS43LQ16256EA-062B2LI) RoHS: Compliant Min Qty: 136 Package Multiple: 136 Lead time: 8 Weeks, 0 Days | 0 |
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RFQ |
Part Details for IS43LQ16256EA-062B2LI
IS43LQ16256EA-062B2LI CAD Models
IS43LQ16256EA-062B2LI Part Data Attributes
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IS43LQ16256EA-062B2LI
Integrated Silicon Solution Inc
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Datasheet
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IS43LQ16256EA-062B2LI
Integrated Silicon Solution Inc
DDR DRAM,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | FBGA-200 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Date Of Intro | 2019-10-23 | |
| Access Mode | MULTI BANK PAGE BURST | |
| Additional Feature | SELF REFRESH, IT ALSO REQUIRES 1.1V NOMINAL SUPPLY, TERM PITCH-MAX | |
| Clock Frequency-Max (fCLK) | 1600 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 16,32 | |
| JESD-30 Code | R-PBGA-B200 | |
| Length | 14.5 mm | |
| Memory Density | 4294967296 bit | |
| Memory IC Type | LPDDR4 DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 200 | |
| Number of Words | 268435456 words | |
| Number of Words Code | 256000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA200,12X22,32/25 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 0.85 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 16,32 | |
| Standby Current-Max | 0.014 A | |
| Supply Current-Max | 0.33 mA | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 10 mm |