Part Details for IS43TR16512S1DL-125KBLI by Integrated Silicon Solution Inc
Overview of IS43TR16512S1DL-125KBLI by Integrated Silicon Solution Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for IS43TR16512S1DL-125KBLI
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
IS43TR16512S1DL-12
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Avnet Americas | DRAM Chip DDR3L SDRAM 8Gbit 512M X 16 1.35V 96-Pin LWBGA - Trays (Alt: IS43TR16512S1DL-12) RoHS: Not Compliant Min Qty: 190 Package Multiple: 190 Lead time: 8 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
DISTI #
IS43TR16512S1DL-125KBLI
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Avnet Asia | DRAM Chip DDR3L SDRAM 8Gbit 512M X 16 1.35V 96-Pin LWBGA (Alt: IS43TR16512S1DL-125KBLI) RoHS: Compliant Min Qty: 190 Package Multiple: 190 Lead time: 12 Weeks, 0 Days | 0 |
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RFQ | |
DISTI #
IS43TR16512S1DL-125KBLI
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Avnet Silica | (Alt: IS43TR16512S1DL-125KBLI) RoHS: Compliant Min Qty: 190 Package Multiple: 190 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Part Details for IS43TR16512S1DL-125KBLI
IS43TR16512S1DL-125KBLI CAD Models
IS43TR16512S1DL-125KBLI Part Data Attributes
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IS43TR16512S1DL-125KBLI
Integrated Silicon Solution Inc
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Datasheet
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IS43TR16512S1DL-125KBLI
Integrated Silicon Solution Inc
DRAM,
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.36 | |
Factory Lead Time | 8 Weeks | |
Access Mode | MULTI BANK PAGE BURST | |
Additional Feature | AUTO/SELF REFRESH | |
Clock Frequency-Max (fCLK) | 800 MHz | |
I/O Type | COMMON | |
Interleaved Burst Length | 4,8 | |
JESD-30 Code | R-PBGA-B96 | |
Length | 14 mm | |
Memory Density | 8589934592 bit | |
Memory IC Type | DDR3 DRAM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 96 | |
Number of Words | 536870912 words | |
Number of Words Code | 512000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 95 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 512MX16 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA96,9X16,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Refresh Cycles | 8192 | |
Seated Height-Max | 1.2 mm | |
Self Refresh | YES | |
Sequential Burst Length | 4,8 | |
Standby Current-Max | 0.121 A | |
Supply Current-Max | 0.248 mA | |
Supply Voltage-Max (Vsup) | 1.45 V | |
Supply Voltage-Min (Vsup) | 1.283 V | |
Supply Voltage-Nom (Vsup) | 1.35 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 10 mm |