Part Details for IS43TR81024BL-125KBL by Integrated Silicon Solution Inc
Overview of IS43TR81024BL-125KBL by Integrated Silicon Solution Inc
- Distributor Offerings: (7 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Industrial Automation
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Robotics and Drones
Price & Stock for IS43TR81024BL-125KBL
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
67AC3818
|
Newark | 8G, 1.35V, Ddr3L, 1Gx8, 1600Mt/S @ 11-11-11, 78 Ball Bga (10Mm X 14Mm) Rohs |Integrated Silicon Solution (Issi) IS43TR81024BL-125KBL Min Qty: 136 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$19.3800 / $19.9500 | Buy Now |
|
DISTI #
706-IS43TR81024BL-125KBL-ND
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DigiKey | 8G, 1.35V, DDR3L, 1Gx8, 1600MT/s Min Qty: 136 Lead time: 8 Weeks Container: Bulk | Temporarily Out of Stock |
|
$21.0949 | Buy Now |
|
DISTI #
IS43TR81024BL-125KBL
|
Avnet Americas | DRAM Chip DDR3L SDRAM 8Gbit 1G X 8 1.35V 78-Pin TWBGA Tray - Trays (Alt: IS43TR81024BL-125KBL) RoHS: Compliant Min Qty: 136 Package Multiple: 136 Lead time: 8 Weeks, 0 Days Container: Tray | 0 |
|
$17.8125 / $21.8025 | Buy Now |
|
DISTI #
870-43T81024BL125KBL
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Mouser Electronics | DRAM 8G, 1.35V, DDR3L, 1Gx8, 1600MT/s a. 11-11-11, 78 ball BGA (10mm x 14mm) RoHS RoHS: Compliant | 0 |
|
$20.0700 / $20.4900 | Order Now |
|
DISTI #
IS43TR81024BL-125KBL
|
Avnet Americas | DRAM Chip DDR3L SDRAM 8Gbit 1G X 8 1.35V 78-Pin TWBGA Tray - Trays (Alt: IS43TR81024BL-125KBL) RoHS: Compliant Min Qty: 136 Package Multiple: 136 Lead time: 8 Weeks, 0 Days Container: Tray | 0 |
|
$17.8125 / $21.8025 | Buy Now |
|
DISTI #
IS43TR81024BL-125KBL
|
Avnet Silica | DRAM Chip DDR3L SDRAM 8Gbit 1G X 8 1.35V 78-Pin TWBGA Tray (Alt: IS43TR81024BL-125KBL) RoHS: Compliant Min Qty: 136 Package Multiple: 136 Lead time: 2 Weeks, 0 Days | Silica - 0 |
|
Buy Now | |
|
|
Chip1Cloud | DDR3-1600 1Gx8 (8Gb) | 2655 |
|
RFQ |
Part Details for IS43TR81024BL-125KBL
IS43TR81024BL-125KBL CAD Models
IS43TR81024BL-125KBL Part Data Attributes:
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|
IS43TR81024BL-125KBL
Integrated Silicon Solution Inc
Buy Now
Datasheet
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Compare Parts:
IS43TR81024BL-125KBL
Integrated Silicon Solution Inc
DRAM,
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | TFBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Factory Lead Time | 8 Weeks | |
| Date Of Intro | 2017-09-18 | |
| Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
| Access Mode | MULTI BANK PAGE BURST | |
| Additional Feature | AUTO/SELF REFRESH | |
| JESD-30 Code | R-PBGA-B78 | |
| JESD-609 Code | e1 | |
| Length | 14 mm | |
| Memory Density | 8589934592 bit | |
| Memory IC Type | DDR3L DRAM | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 78 | |
| Number of Words | 1073741824 words | |
| Number of Words Code | 1000000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | ||
| Organization | 1GX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 1.45 V | |
| Supply Voltage-Min (Vsup) | 1.283 V | |
| Supply Voltage-Nom (Vsup) | 1.35 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 10 | |
| Width | 10 mm |