Part Details for IS46DR16640C-3DBLA2-TR by Integrated Silicon Solution Inc
Overview of IS46DR16640C-3DBLA2-TR by Integrated Silicon Solution Inc
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for IS46DR16640C-3DBLA2-TR
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
13AC5170
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Newark | Automotive (Tc: -40 To +105C),1G, 1.8V, Ddr2, 64Mx16, 333Mhz @ Cl5, 84 Ball Bga (8Mm X 12.5Mm) Rohs, T&r |Integrated Silicon Solution (Issi) IS46DR16640C-3DBLA2-TR RoHS: Not Compliant Min Qty: 2500 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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$4.3000 | Buy Now |
DISTI #
IS46DR16640C-3DBLA2-TR-ND
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DigiKey | IC DRAM 1GBIT PARALLEL 84TWBGA Min Qty: 2500 Lead time: 10 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$5.0248 | Buy Now |
DISTI #
IS46DR16640C-3DBLA
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Avnet Americas | DRAM Chip DDR2 DRAM 1G-Bit 64Mx16 333MHz 1.8V -40 to +105?C AT 84-Ball BGA T/R - Tape and Reel (Alt: IS46DR16640C-3DBLA) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 10 Weeks, 0 Days Container: Reel | 0 |
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$4.7239 | Buy Now |
DISTI #
870-4616640C3DBLA2T
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Mouser Electronics | DRAM Automotive (Tc: -40 to +105C),1G, 1.8V, DDR2, 64Mx16, 333Mhz a. CL5, 84 ball BGA (8mmx12.5mm) RoHS, T&R RoHS: Compliant | 0 |
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$4.8700 | Order Now |
DISTI #
IS46DR16640C-3DBLA2-TR
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Avnet Asia | DRAM Chip DDR2 DRAM 1G-Bit 64Mx16 333MHz 1.8V -40 to +105?C AT 84-Ball BGA T/R (Alt: IS46DR16640C-3DBLA2-TR) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 8 Weeks, 0 Days | 0 |
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RFQ |
Part Details for IS46DR16640C-3DBLA2-TR
IS46DR16640C-3DBLA2-TR CAD Models
IS46DR16640C-3DBLA2-TR Part Data Attributes
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IS46DR16640C-3DBLA2-TR
Integrated Silicon Solution Inc
Buy Now
Datasheet
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IS46DR16640C-3DBLA2-TR
Integrated Silicon Solution Inc
DDR DRAM,
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
Package Description | TFBGA, | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.32 | |
Factory Lead Time | 10 Weeks | |
Access Mode | MULTI BANK PAGE BURST | |
Access Time-Max | 0.45 ns | |
Additional Feature | AUTO/SELF REFRESH | |
JESD-30 Code | R-PBGA-B84 | |
Length | 12.5 mm | |
Memory Density | 1073741824 bit | |
Memory IC Type | DDR2 DRAM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 84 | |
Number of Words | 67108864 words | |
Number of Words Code | 64000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 64MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Seated Height-Max | 1.2 mm | |
Self Refresh | YES | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 8 mm |