There are no models available for this part yet.
Overview of IS46DR81280B-3DBLA2 by Integrated Silicon Solution Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for IS46DR81280B-3DBLA2 by Integrated Silicon Solution Inc
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
IS46DR81280B-3DBLA2-ND
|
DigiKey | IC DRAM 1GBIT PARALLEL 60TWBGA Lead time: 10 Weeks Container: Tray | Temporarily Out of Stock |
|
Buy Now | ||
|
DISTI #
IS46DR81280B-3DBLA
|
Avnet Americas | DRAM Chip DDR2 SDRAM 1G-Bit 128M x 8 1.8V 60-Pin TWBGA - Bulk (Alt: IS46DR81280B-3DBLA) RoHS: Not Compliant Min Qty: 242 Package Multiple: 242 Lead time: 10 Weeks, 0 Days Container: Bulk | 0 |
|
RFQ |
CAD Models for IS46DR81280B-3DBLA2 by Integrated Silicon Solution Inc
Part Data Attributes for IS46DR81280B-3DBLA2 by Integrated Silicon Solution Inc
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Not Recommended
|
|
Ihs Manufacturer
|
INTEGRATED SILICON SOLUTION INC
|
|
Package Description
|
TFBGA, BGA60,9X11,32
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.32
|
|
Factory Lead Time
|
10 Weeks
|
|
Samacsys Manufacturer
|
Integrated Silicon Solution Inc.
|
|
Access Mode
|
MULTI BANK PAGE BURST
|
|
Access Time-Max
|
0.45 ns
|
|
Additional Feature
|
AUTO/SELF REFRESH
|
|
Clock Frequency-Max (fCLK)
|
333 MHz
|
|
I/O Type
|
COMMON
|
|
Interleaved Burst Length
|
4,8
|
|
JESD-30 Code
|
R-PBGA-B84
|
|
Length
|
12.5 mm
|
|
Memory Density
|
1073741824 bit
|
|
Memory IC Type
|
DDR2 DRAM
|
|
Memory Width
|
16
|
|
Number of Functions
|
1
|
|
Number of Ports
|
1
|
|
Number of Terminals
|
84
|
|
Number of Words
|
67108864 words
|
|
Number of Words Code
|
64000000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
105 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
64MX16
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
TFBGA
|
|
Package Equivalence Code
|
BGA60,9X11,32
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
|
Qualification Status
|
Not Qualified
|
|
Refresh Cycles
|
8192
|
|
Screening Level
|
AEC-Q100
|
|
Seated Height-Max
|
1.2 mm
|
|
Self Refresh
|
YES
|
|
Sequential Burst Length
|
4,8
|
|
Supply Current-Max
|
0.27 mA
|
|
Supply Voltage-Max (Vsup)
|
1.9 V
|
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
0.8 mm
|
|
Terminal Position
|
BOTTOM
|
|
Width
|
8 mm
|
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