There are no models available for this part yet.
Overview of IS46LQ16128AL-062BLA2 by Integrated Silicon Solution Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 3 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for IS46LQ16128AL-062BLA2 by Integrated Silicon Solution Inc
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
89AH8556
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Newark | Automotive (Tc: -40 To +105C), 2G, 0.57-0.65V/1.06-1.17/1.70-1.95V, Lpddr4X, 128Mx16, 1600Mhz, 200 Ball Bga (10Mm X 14.5Mm) Rohs |Integrated Silicon Solution (Issi) IS46LQ16128AL-062BLA2 RoHS: Not Compliant Min Qty: 136 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$11.9700 / $13.6100 | Buy Now | |
|
DISTI #
IS46LQ16128AL-062B
|
Avnet Americas | DRAM Chip LPDDR4 SDRAM 2Gbit 128M X 16 1.1V/1.8V 200-Pin BGA - Trays (Alt: IS46LQ16128AL-062B) RoHS: Not Compliant Min Qty: 136 Package Multiple: 136 Lead time: 14 Weeks, 0 Days Container: Tray | 0 |
|
RFQ | ||
|
DISTI #
870-46L128A062BLA2
|
Mouser Electronics | DRAM Automotive (Tc: -40 to +105C), 2G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm) RoHS RoHS: Compliant | 0 |
|
$11.9900 / $12.6200 | Order Now |
CAD Models for IS46LQ16128AL-062BLA2 by Integrated Silicon Solution Inc
Part Data Attributes for IS46LQ16128AL-062BLA2 by Integrated Silicon Solution Inc
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Active
|
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Ihs Manufacturer
|
INTEGRATED SILICON SOLUTION INC
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|
Package Description
|
VFBGA,
|
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Reach Compliance Code
|
compliant
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ECCN Code
|
EAR99
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HTS Code
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8542.32.00.36
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Factory Lead Time
|
14 Weeks
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Access Mode
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MULTI BANK PAGE BURST
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Clock Frequency-Max (fCLK)
|
1600 MHz
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I/O Type
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COMMON
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Interleaved Burst Length
|
16,32
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JESD-30 Code
|
R-PBGA-B200
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Length
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14.5 mm
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Memory Density
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2147483648 bit
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Memory IC Type
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LPDDR4X DRAM
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Memory Width
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16
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Number of Functions
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1
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Number of Ports
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1
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Number of Terminals
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200
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Number of Words
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134217728 words
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Number of Words Code
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128000000
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Operating Mode
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SYNCHRONOUS
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Operating Temperature-Max
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105 °C
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Operating Temperature-Min
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-40 °C
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Organization
|
128MX16
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Output Characteristics
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3-STATE
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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VFBGA
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Package Equivalence Code
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BGA200,12X22,32/25
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Package Shape
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RECTANGULAR
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Package Style
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GRID ARRAY, VERY THIN PROFILE, FINE PITCH
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Refresh Cycles
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8192
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Screening Level
|
AEC-Q100
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Seated Height-Max
|
0.85 mm
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Self Refresh
|
NO
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Sequential Burst Length
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16,32
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Supply Voltage-Max (Vsup)
|
1.95 V
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Supply Voltage-Min (Vsup)
|
1.7 V
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Supply Voltage-Nom (Vsup)
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1.8 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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INDUSTRIAL
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Terminal Form
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BALL
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Terminal Pitch
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0.8 mm
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Terminal Position
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BOTTOM
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Width
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10 mm
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