Part Details for IS46LQ32128EA-062B2LA2 by Integrated Silicon Solution Inc
Overview of IS46LQ32128EA-062B2LA2 by Integrated Silicon Solution Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for IS46LQ32128EA-062B2LA2
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
IS46LQ32128EA-062B2LA2
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Avnet Silica | 4Gb (x16/x32) Mobile LPDDR4/LPDDR4X with ECC (Alt: IS46LQ32128EA-062B2LA2) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 10 Weeks, 0 Days | Silica - 0 |
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Part Details for IS46LQ32128EA-062B2LA2
IS46LQ32128EA-062B2LA2 CAD Models
IS46LQ32128EA-062B2LA2 Part Data Attributes
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IS46LQ32128EA-062B2LA2
Integrated Silicon Solution Inc
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Datasheet
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IS46LQ32128EA-062B2LA2
Integrated Silicon Solution Inc
DDR DRAM,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | FBGA-200 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Date Of Intro | 2019-10-23 | |
| Access Mode | MULTI BANK PAGE BURST | |
| Clock Frequency-Max (fCLK) | 1600 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 16,32 | |
| JESD-30 Code | R-PBGA-B200 | |
| Length | 14.5 mm | |
| Memory Density | 4294967296 bit | |
| Memory IC Type | LPDDR4 DRAM | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 200 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128MX32 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA200,12X22,32/25 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Refresh Cycles | 8192 | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 0.8 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 16,32 | |
| Standby Current-Max | 0.00024 A | |
| Supply Current-Max | 0.66 mA | |
| Supply Voltage-Max (Vsup) | 1.17 V | |
| Supply Voltage-Min (Vsup) | 1.06 V | |
| Supply Voltage-Nom (Vsup) | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 10 mm |