Part Details for IS46QR16256B-083RBLA3 by Integrated Silicon Solution Inc
Overview of IS46QR16256B-083RBLA3 by Integrated Silicon Solution Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for IS46QR16256B-083RBLA3
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
IS46QR16256B-083RB
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Avnet Americas | 256Mbx16 4Gb DDR4 SDRAM (Tc : -40oC to +125C) - Trays (Alt: IS46QR16256B-083RB) Min Qty: 198 Package Multiple: 198 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
DISTI #
IS46QR16256B-083RBLA3
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Avnet Silica | 256Mbx16 4Gb DDR4 SDRAM (Tc : -40oC to +125C) (Alt: IS46QR16256B-083RBLA3) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Part Details for IS46QR16256B-083RBLA3
IS46QR16256B-083RBLA3 CAD Models
IS46QR16256B-083RBLA3 Part Data Attributes
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IS46QR16256B-083RBLA3
Integrated Silicon Solution Inc
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Datasheet
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IS46QR16256B-083RBLA3
Integrated Silicon Solution Inc
DDR4 DRAM, 256MX16, CMOS, PBGA96,
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
Reach Compliance Code | compliant | |
Factory Lead Time | 12 Weeks | |
Access Mode | DUAL BANK PAGE BURST | |
Additional Feature | AUTO/SELF REFRESH | |
Clock Frequency-Max (fCLK) | 1200.48 MHz | |
I/O Type | COMMON | |
Interleaved Burst Length | 8 | |
JESD-30 Code | R-PBGA-B96 | |
Length | 13.5 mm | |
Memory Density | 4294967296 bit | |
Memory IC Type | DDR4 DRAM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 96 | |
Number of Words | 268435456 words | |
Number of Words Code | 256000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 256MX16 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA96,9X16,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.2 mm | |
Self Refresh | YES | |
Sequential Burst Length | 8 | |
Standby Current-Max | 0.058 A | |
Standby Voltage-Min | 1.14 V | |
Supply Current-Max | 0.375 mA | |
Supply Voltage-Max (Vsup) | 1.26 V | |
Supply Voltage-Min (Vsup) | 1.14 V | |
Supply Voltage-Nom (Vsup) | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 7.5 mm |