Part Details for IS46R16160D-6BLA1-TR by Integrated Silicon Solution Inc
Overview of IS46R16160D-6BLA1-TR by Integrated Silicon Solution Inc
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Price & Stock for IS46R16160D-6BLA1-TR
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
IS46R16160D-6BLA1-TR-ND
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DigiKey | IC DRAM 256MBIT PAR 60TFBGA Min Qty: 2500 Lead time: 12 Weeks Container: Tape & Reel (TR) | Limited Supply - Call |
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$5.6790 | Buy Now |
DISTI #
IS46R16160D-6BLA1-
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Avnet Americas | DRAM Chip DDR SDRAM 256M-Bit 16M x 16 2.5V 60-Pin TFBGA T/R - Tape and Reel (Alt: IS46R16160D-6BLA1-) RoHS: Not Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 12 Weeks, 0 Days Container: Reel | 2500 |
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RFQ | |
DISTI #
870-S46R16160D6BLA1R
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Mouser Electronics | DRAM Automotive (-40 to +85C), 256M, 2.5V, DDR1, 64Mx8, 166MHz, 60 ball FBGA RoHS, T&R RoHS: Compliant | 0 |
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$5.5100 | Order Now |
DISTI #
IS46R16160D-6BLA1-
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Avnet Americas | DRAM Chip DDR SDRAM 256M-Bit 16M x 16 2.5V 60-Pin TFBGA T/R - Tape and Reel (Alt: IS46R16160D-6BLA1-) RoHS: Not Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 12 Weeks, 0 Days Container: Reel | 2500 |
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RFQ | |
DISTI #
IS46R16160D-6BLA1-
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Avnet Americas | DRAM Chip DDR SDRAM 256M-Bit 16M x 16 2.5V 60-Pin TFBGA T/R - Tape and Reel (Alt: IS46R16160D-6BLA1-) RoHS: Not Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 12 Weeks, 0 Days Container: Reel | 2500 |
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RFQ |
Part Details for IS46R16160D-6BLA1-TR
IS46R16160D-6BLA1-TR CAD Models
IS46R16160D-6BLA1-TR Part Data Attributes
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IS46R16160D-6BLA1-TR
Integrated Silicon Solution Inc
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Datasheet
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IS46R16160D-6BLA1-TR
Integrated Silicon Solution Inc
DDR DRAM, 16MX16, 0.7ns, CMOS, PBGA60,
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Rohs Code | Yes | |
Part Life Cycle Code | Not Recommended | |
Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
Package Description | BGA, BGA60,9X12,40/32 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.24 | |
Factory Lead Time | 12 Weeks | |
Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
Access Time-Max | 0.7 ns | |
Clock Frequency-Max (fCLK) | 166 MHz | |
I/O Type | COMMON | |
Interleaved Burst Length | 2,4,8 | |
JESD-30 Code | R-PBGA-B60 | |
Memory Density | 268435456 bit | |
Memory IC Type | DDR1 DRAM | |
Memory Width | 16 | |
Number of Terminals | 60 | |
Number of Words | 16777216 words | |
Number of Words Code | 16000000 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 16MX16 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA60,9X12,40/32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Refresh Cycles | 8192 | |
Sequential Burst Length | 2,4,8 | |
Standby Current-Max | 0.004 A | |
Supply Current-Max | 0.405 mA | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM |