Part Details for IS46TR16K01S2AL-125KBLA2 by Integrated Silicon Solution Inc
Overview of IS46TR16K01S2AL-125KBLA2 by Integrated Silicon Solution Inc
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- Number of Functional Equivalents:
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Price & Stock for IS46TR16K01S2AL-125KBLA2
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
89AH8576
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Newark | Automotive (Tc: -40 To +105C), 16G, 1.35V, Ddr3L, 1Gx16,1600Mt/S @ 11-11-11, 96 Ball Bga (10Mm X 14.5Mm) Rohs, It |Integrated Silicon Solution (Issi) IS46TR16K01S2AL-125KBLA2 Min Qty: 136 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$35.2300 | Buy Now |
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DISTI #
706-IS46TR16K01S2AL-125KBLA2-ND
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DigiKey | Automotive (Tc: -40 to +105C), 1 Min Qty: 136 Lead time: 16 Weeks Container: Bulk | Temporarily Out of Stock |
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$37.4288 | Buy Now |
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DISTI #
IS46TR16K01S2AL-125KBLA2
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Avnet Americas | DRAM Chip DDR3 SDRAM 16Gbit 1G X 16 1.5V 96-Pin BGA - Trays (Alt: IS46TR16K01S2AL-125KBLA2) Min Qty: 136 Package Multiple: 136 Lead time: 14 Weeks, 0 Days Container: Tray | 0 |
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$33.6125 / $41.1417 | Buy Now |
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DISTI #
870-6K01S2AL125KBLA2
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Mouser Electronics | DRAM Automotive (Tc: -40 to +105C), 16G, 1.35V, DDR3L, 1Gx16,1600MT/s a. 11-11-11, 96 ball BGA (10mm x 14.5mm) RoHS, IT | 153 |
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$36.2200 / $47.5500 | Buy Now |
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DISTI #
IS46TR16K01S2AL-125KBLA2
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Avnet Americas | DRAM Chip DDR3 SDRAM 16Gbit 1G X 16 1.5V 96-Pin BGA - Trays (Alt: IS46TR16K01S2AL-125KBLA2) Min Qty: 136 Package Multiple: 136 Lead time: 14 Weeks, 0 Days Container: Tray | 0 |
|
$33.6125 / $41.1417 | Buy Now |
|
DISTI #
IS46TR16K01S2AL-125KBLA2
|
Avnet Americas | DRAM Chip DDR3 SDRAM 16Gbit 1G X 16 1.5V 96-Pin BGA - Trays (Alt: IS46TR16K01S2AL-125KBLA2) Min Qty: 136 Package Multiple: 136 Lead time: 14 Weeks, 0 Days Container: Tray | 0 |
|
$33.6125 / $41.1417 | Buy Now |
Part Details for IS46TR16K01S2AL-125KBLA2
IS46TR16K01S2AL-125KBLA2 CAD Models
IS46TR16K01S2AL-125KBLA2 Part Data Attributes
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IS46TR16K01S2AL-125KBLA2
Integrated Silicon Solution Inc
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Datasheet
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IS46TR16K01S2AL-125KBLA2
Integrated Silicon Solution Inc
DDR DRAM,
|
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | LFBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Factory Lead Time | 14 Weeks | |
| Date Of Intro | 2018-07-17 | |
| Access Mode | DUAL BANK PAGE BURST | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 800 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 4,8 | |
| JESD-30 Code | R-PBGA-B96 | |
| Length | 14 mm | |
| Memory Density | 17179869184 bit | |
| Memory IC Type | DDR3L DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 96 | |
| Number of Words | 1073741824 words | |
| Number of Words Code | 1000000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1GX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA96,9X16,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1.4 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 4,8 | |
| Standby Current-Max | 0.068 A | |
| Standby Voltage-Min | 1.283 V | |
| Supply Current-Max | 0.262 mA | |
| Supply Voltage-Max (Vsup) | 1.45 V | |
| Supply Voltage-Min (Vsup) | 1.283 V | |
| Supply Voltage-Nom (Vsup) | 1.35 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 10 mm |