Part Details for IS49NLS93200A-25WBL by Integrated Silicon Solution Inc
Overview of IS49NLS93200A-25WBL by Integrated Silicon Solution Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for IS49NLS93200A-25WBL
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
14AK4890
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Newark | Rldram2 Memory, 288Mbit, X9, Separate I/O, 400Mhz, Trc=20Ns, Rohs |Integrated Silicon Solution (Issi) IS49NLS93200A-25WBL Min Qty: 104 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$27.4200 / $28.2300 | Buy Now |
DISTI #
706-IS49NLS93200A-25WBL-ND
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DigiKey | RLDRAM2 Memory, 288Mbit, x9, Sep Min Qty: 104 Lead time: 8 Weeks Container: Bulk | Temporarily Out of Stock |
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$28.0612 | Buy Now |
DISTI #
870-49NLS93200A25WBL
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Mouser Electronics | DRAM RLDRAM2 Memory, 288Mbit, x9, Separate I/O, 400MHz, tRC=20ns, RoHS RoHS: Compliant | 0 |
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$26.8200 / $27.2500 | Order Now |
Part Details for IS49NLS93200A-25WBL
IS49NLS93200A-25WBL CAD Models
IS49NLS93200A-25WBL Part Data Attributes:
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IS49NLS93200A-25WBL
Integrated Silicon Solution Inc
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Datasheet
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IS49NLS93200A-25WBL
Integrated Silicon Solution Inc
DDR DRAM, 32MX9, CMOS, PBGA144,
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
Reach Compliance Code | compliant | |
Access Mode | MULTI BANK PAGE BURST | |
Clock Frequency-Max (fCLK) | 400 MHz | |
I/O Type | SEPARATE | |
JESD-30 Code | R-PBGA-B144 | |
Length | 18.5 mm | |
Memory Density | 301989888 bit | |
Memory IC Type | DDR DRAM | |
Memory Width | 9 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 144 | |
Number of Words | 33554432 words | |
Number of Words Code | 32000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 95 °C | |
Operating Temperature-Min | ||
Organization | 32MX9 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TBGA | |
Package Equivalence Code | BGA144,12X18,40/32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Refresh Cycles | 16384 | |
Seated Height-Max | 1.2 mm | |
Self Refresh | YES | |
Sequential Burst Length | 2,4,8 | |
Standby Current-Max | 0.236 A | |
Supply Current-Max | 0.768 mA | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 11 mm |