Part Details for K4J55323QF-GL20 by Samsung Semiconductor
Overview of K4J55323QF-GL20 by Samsung Semiconductor
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Computing and Data Storage
Price & Stock for K4J55323QF-GL20
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 1772 |
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RFQ |
Part Details for K4J55323QF-GL20
K4J55323QF-GL20 CAD Models
K4J55323QF-GL20 Part Data Attributes
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K4J55323QF-GL20
Samsung Semiconductor
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Datasheet
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K4J55323QF-GL20
Samsung Semiconductor
DDR DRAM, 8MX32, 0.35ns, CMOS, PBGA144
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
Package Description | FBGA, BGA144,12X12,32 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.24 | |
Access Time-Max | 0.35 ns | |
Clock Frequency-Max (fCLK) | 500 MHz | |
I/O Type | COMMON | |
Interleaved Burst Length | 4 | |
JESD-30 Code | S-PBGA-B144 | |
Memory Density | 268435456 bit | |
Memory IC Type | GDDR3 DRAM | |
Memory Width | 32 | |
Number of Terminals | 144 | |
Number of Words | 8388608 words | |
Number of Words Code | 8000000 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 8MX32 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA144,12X12,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Qualification Status | Not Qualified | |
Refresh Cycles | 4096 | |
Sequential Burst Length | 4 | |
Standby Current-Max | 0.13 A | |
Supply Current-Max | 0.95 mA | |
Supply Voltage-Nom (Vsup) | 2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM |