Datasheets
K4W1G1646E-HC12 by:

DDR DRAM, 64MX16, 0.225ns, CMOS, PBGA96

Part Details for K4W1G1646E-HC12 by Samsung Semiconductor

Overview of K4W1G1646E-HC12 by Samsung Semiconductor

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Price & Stock for K4W1G1646E-HC12

Part # Distributor Description Stock Price Buy
Bristol Electronics   423
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Part Details for K4W1G1646E-HC12

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K4W1G1646E-HC12 Part Data Attributes

K4W1G1646E-HC12 Samsung Semiconductor
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K4W1G1646E-HC12 Samsung Semiconductor DDR DRAM, 64MX16, 0.225ns, CMOS, PBGA96
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.32
Access Time-Max 0.225 ns
Clock Frequency-Max (fCLK) 800 MHz
I/O Type COMMON
Interleaved Burst Length 4,8
JESD-30 Code R-PBGA-B96
Memory Density 1073741824 bit
Memory IC Type DDR3 DRAM
Memory Width 16
Number of Terminals 96
Number of Words 67108864 words
Number of Words Code 64000000
Organization 64MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA96,9X16,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Refresh Cycles 8192
Sequential Burst Length 4,8
Standby Current-Max 0.01 A
Supply Current-Max 0.29 mA
Supply Voltage-Nom (Vsup) 1.5 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM

Alternate Parts for K4W1G1646E-HC12

This table gives cross-reference parts and alternative options found for K4W1G1646E-HC12. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K4W1G1646E-HC12, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
NT5CB64M16FP-DII DDR DRAM, 64MX16, 0.225ns, CMOS, PBGA96, TFBGA-96 Nanya Technology Corporation K4W1G1646E-HC12 vs NT5CB64M16FP-DII
K4B1G1646E-HCK00 DDR DRAM, 64MX16, 0.225ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96 Samsung Semiconductor K4W1G1646E-HC12 vs K4B1G1646E-HCK00
H5TQ1G63AFP-H8C DDR DRAM, 64MX16, 0.125ns, CMOS, PBGA96, FBGA-96 SK Hynix Inc K4W1G1646E-HC12 vs H5TQ1G63AFP-H8C
MT41J64M16JT-15EIT:G DDR DRAM, 64MX16, 0.125ns, CMOS, PBGA96, 8 X 14 MM, LEAD FREE, FBGA-96 Micron Technology Inc K4W1G1646E-HC12 vs MT41J64M16JT-15EIT:G
K4W1G1646E-HC120 DDR DRAM, 64MX16, 0.225ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96 Samsung Semiconductor K4W1G1646E-HC12 vs K4W1G1646E-HC120
H5TQ1G63AFPR-H8C DDR DRAM, 64MX16, CMOS, PBGA96, HALOGEN FREE, FBGA-96 SK Hynix Inc K4W1G1646E-HC12 vs H5TQ1G63AFPR-H8C
EDJ1116DBSE-GN-F DDR DRAM, 64MX16, 0.225ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96 Elpida Memory Inc K4W1G1646E-HC12 vs EDJ1116DBSE-GN-F
MT41J64M16JT-15E:G DDR DRAM, 64MX16, 0.125ns, CMOS, PBGA96, 8 X 14 MM, LEAD FREE, FBGA-96 Micron Technology Inc K4W1G1646E-HC12 vs MT41J64M16JT-15E:G
MT41J64M16LA-125F:B DDR DRAM, 64MX16, 0.225ns, CMOS, PBGA96, 9 X 15.50 MM, LEAD FREE, FBGA-96 Micron Technology Inc K4W1G1646E-HC12 vs MT41J64M16LA-125F:B
H5TQ1G63AFP-S6C DDR DRAM, 64MX16, 0.4ns, CMOS, PBGA96, FPBGA-96 SK Hynix Inc K4W1G1646E-HC12 vs H5TQ1G63AFP-S6C

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