Part Details for K9F5608Q0C-JCB00 by Samsung Semiconductor
Overview of K9F5608Q0C-JCB00 by Samsung Semiconductor
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- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
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Part Details for K9F5608Q0C-JCB00
K9F5608Q0C-JCB00 CAD Models
K9F5608Q0C-JCB00 Part Data Attributes
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K9F5608Q0C-JCB00
Samsung Semiconductor
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Datasheet
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K9F5608Q0C-JCB00
Samsung Semiconductor
Flash, 32MX8, 35ns, PBGA63, 9 X 11 MM, 0.80 MM PITCH, LEAD FREE, FBGA-63
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Part Package Code | BGA | |
| Package Description | VFBGA, BGA63,10X12,32 | |
| Pin Count | 63 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 35 ns | |
| Additional Feature | CONTAINS ADDITIONAL 8M BIT SPARE MEMORY | |
| Command User Interface | YES | |
| Data Polling | NO | |
| JESD-30 Code | R-PBGA-B63 | |
| Length | 11 mm | |
| Memory Density | 268435456 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Sectors/Size | 2K | |
| Number of Terminals | 63 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32MX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA63,10X12,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Page Size | 512 words | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 1.8 V | |
| Qualification Status | Not Qualified | |
| Ready/Busy | YES | |
| Seated Height-Max | 1 mm | |
| Sector Size | 16K | |
| Standby Current-Max | 0.00005 A | |
| Supply Current-Max | 0.02 mA | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Toggle Bit | NO | |
| Width | 9 mm |
Alternate Parts for K9F5608Q0C-JCB00
This table gives cross-reference parts and alternative options found for K9F5608Q0C-JCB00. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K9F5608Q0C-JCB00, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| K9F5608Q0C-GCB00 | Flash, 32MX8, 35ns, PBGA63, 9 X 11 MM, 0.80 MM PITCH, FBGA-63 | Samsung Semiconductor | K9F5608Q0C-JCB00 vs K9F5608Q0C-GCB00 |
| K9F5608Q0C-GIB00 | Flash, 32MX8, 35ns, PBGA63, 9 X 11 MM, 0.80 MM PITCH, FBGA-63 | Samsung Semiconductor | K9F5608Q0C-JCB00 vs K9F5608Q0C-GIB00 |