Part Details for K9MDG08U5M-PCB0 by Samsung Semiconductor
Overview of K9MDG08U5M-PCB0 by Samsung Semiconductor
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Healthcare
Part Details for K9MDG08U5M-PCB0
K9MDG08U5M-PCB0 CAD Models
K9MDG08U5M-PCB0 Part Data Attributes
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K9MDG08U5M-PCB0
Samsung Semiconductor
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K9MDG08U5M-PCB0
Samsung Semiconductor
Flash, 16GX8, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Part Package Code | TSOP1 | |
| Package Description | 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 | |
| Pin Count | 48 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Additional Feature | WD-MAX | |
| JESD-30 Code | R-PDSO-G48 | |
| Length | 18.8 mm | |
| Memory Density | 137438953472 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Number of Words | 17179869184 words | |
| Number of Words Code | 16000000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 16GX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSOP1 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 3.3 V | |
| Seated Height-Max | 2.35 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Width | 12.4 mm |