Part Details for KLM8G1GEME-B041 by Samsung Semiconductor
Overview of KLM8G1GEME-B041 by Samsung Semiconductor
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Applications
Consumer Electronics
Price & Stock for KLM8G1GEME-B041
Part # | Distributor | Description | Stock | Price | Buy | |
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Chip 1 Exchange | INSTOCK | 6940 |
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RFQ |
Part Details for KLM8G1GEME-B041
KLM8G1GEME-B041 CAD Models
KLM8G1GEME-B041 Part Data Attributes
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KLM8G1GEME-B041
Samsung Semiconductor
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Datasheet
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KLM8G1GEME-B041
Samsung Semiconductor
Flash Card,
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Part Life Cycle Code | End Of Life | |
Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
Package Description | PACKAGE-153 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Date Of Intro | 2018-02-13 | |
Samacsys Manufacturer | SAMSUNG | |
JESD-30 Code | R-PBGA-B153 | |
Memory Density | 68719476736 bit | |
Memory IC Type | FLASH CARD | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 153 | |
Number of Words | 8589934592 words | |
Number of Words Code | 8000000000 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -25 °C | |
Organization | 8GX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Shape | RECTANGULAR | |
Programming Voltage | 1.8 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Type | NAND TYPE |