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KLM8G1GEME-B041 by:

Flash Card,

Part Details for KLM8G1GEME-B041 by Samsung Semiconductor

Overview of KLM8G1GEME-B041 by Samsung Semiconductor

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Chip 1 Exchange INSTOCK 6940
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Part Details for KLM8G1GEME-B041

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KLM8G1GEME-B041 Part Data Attributes

KLM8G1GEME-B041 Samsung Semiconductor
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KLM8G1GEME-B041 Samsung Semiconductor Flash Card,
Part Life Cycle Code End Of Life
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Package Description PACKAGE-153
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Date Of Intro 2018-02-13
Samacsys Manufacturer SAMSUNG
JESD-30 Code R-PBGA-B153
Memory Density 68719476736 bit
Memory IC Type FLASH CARD
Memory Width 8
Number of Functions 1
Number of Terminals 153
Number of Words 8589934592 words
Number of Words Code 8000000000
Operating Temperature-Max 85 °C
Operating Temperature-Min -25 °C
Organization 8GX8
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Programming Voltage 1.8 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Form BALL
Terminal Position BOTTOM
Type NAND TYPE

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