Part Details for LPC11U14FHN33/201 by NXP Semiconductors
Overview of LPC11U14FHN33/201 by NXP Semiconductors
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Part Details for LPC11U14FHN33/201
LPC11U14FHN33/201 CAD Models
LPC11U14FHN33/201 Part Data Attributes:
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LPC11U14FHN33/201
NXP Semiconductors
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Datasheet
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LPC11U14FHN33/201
NXP Semiconductors
IC RISC MICROCONTROLLER, Microcontroller
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Clock Frequency-Max | 25 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | ||
| JESD-30 Code | S-PQCC-N33 | |
| Length | 7 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 26 | |
| Number of Terminals | 33 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| RAM (bytes) | 6144 | |
| ROM (words) | 32768 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1 mm | |
| Speed | 50 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3.3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | QUAD | |
| Width | 7 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |