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IC 32-BIT, FLASH, 72 MHz, RISC MICROCONTROLLER, PBGA180, 12 X 12 MM, 0.80 MM HEIGHT, SOT570-2, TFBGA-180, Microcontroller
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Part # | Distributor | Description | Stock | Price | Buy | |
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ComSIT USA | Single-chip 16-bit/32-bit micro, 512 kB flash, Ethernet, CAN Microcontroller RISC Microcontroller, 32-Bit, FLASH, ARM7 CPU, 72MHz, CMOS, PBGA180 RoHS: Not Compliant | Europe - 78 |
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LPC2458FET180
NXP Semiconductors
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LPC2458FET180
NXP Semiconductors
IC 32-BIT, FLASH, 72 MHz, RISC MICROCONTROLLER, PBGA180, 12 X 12 MM, 0.80 MM HEIGHT, SOT570-2, TFBGA-180, Microcontroller
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Not Recommended | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | BGA | |
Package Description | TFBGA, BGA180,14X14,32 | |
Pin Count | 180 | |
Manufacturer Package Code | SOT-570-1 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Address Bus Width | 20 | |
Bit Size | 32 | |
CPU Family | ARM7 | |
Clock Frequency-Max | 24 MHz | |
DAC Channels | YES | |
DMA Channels | YES | |
External Data Bus Width | 16 | |
JESD-30 Code | S-PBGA-B180 | |
JESD-609 Code | e1 | |
Length | 12 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 136 | |
Number of Terminals | 180 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA180,14X14,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 100352 | |
ROM (words) | 524288 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.2 mm | |
Speed | 72 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 12 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |