Datasheets
LPC2458FET180 by: NXP Semiconductors

IC 32-BIT, FLASH, 72 MHz, RISC MICROCONTROLLER, PBGA180, 12 X 12 MM, 0.80 MM HEIGHT, SOT570-2, TFBGA-180, Microcontroller

Part Details for LPC2458FET180 by NXP Semiconductors

Overview of LPC2458FET180 by NXP Semiconductors

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Price & Stock for LPC2458FET180

Part # Distributor Description Stock Price Buy
ComSIT USA Single-chip 16-bit/32-bit micro, 512 kB flash, Ethernet, CAN Microcontroller RISC Microcontroller, 32-Bit, FLASH, ARM7 CPU, 72MHz, CMOS, PBGA180 RoHS: Not Compliant Europe - 78
RFQ

Part Details for LPC2458FET180

LPC2458FET180 CAD Models

LPC2458FET180 Part Data Attributes

LPC2458FET180 NXP Semiconductors
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LPC2458FET180 NXP Semiconductors IC 32-BIT, FLASH, 72 MHz, RISC MICROCONTROLLER, PBGA180, 12 X 12 MM, 0.80 MM HEIGHT, SOT570-2, TFBGA-180, Microcontroller
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code BGA
Package Description TFBGA, BGA180,14X14,32
Pin Count 180
Manufacturer Package Code SOT-570-1
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Samacsys Manufacturer NXP
Has ADC YES
Address Bus Width 20
Bit Size 32
CPU Family ARM7
Clock Frequency-Max 24 MHz
DAC Channels YES
DMA Channels YES
External Data Bus Width 16
JESD-30 Code S-PBGA-B180
JESD-609 Code e1
Length 12 mm
Moisture Sensitivity Level 3
Number of I/O Lines 136
Number of Terminals 180
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA180,14X14,32
Package Shape SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (bytes) 100352
ROM (words) 524288
ROM Programmability FLASH
Seated Height-Max 1.2 mm
Speed 72 MHz
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 12 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC

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