Part Details for M87C257-10C1X by STMicroelectronics
Overview of M87C257-10C1X by STMicroelectronics
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- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Part Details for M87C257-10C1X
M87C257-10C1X CAD Models
M87C257-10C1X Part Data Attributes
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M87C257-10C1X
STMicroelectronics
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Datasheet
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M87C257-10C1X
STMicroelectronics
IC,EPROM,32KX8,CMOS,LDCC,32PIN,PLASTIC
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Contact Manufacturer | |
Ihs Manufacturer | STMICROELECTRONICS | |
Package Description | QCCJ, LDCC32,.5X.6 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 70 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-PQCC-J32 | |
JESD-609 Code | e3 | |
Length | 13.995 mm | |
Memory Density | 4096 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 32768 words | |
Number of Words Code | 512 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 512X8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QCCJ | |
Package Equivalence Code | LDCC32,.5X.6 | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER | |
Parallel/Serial | PARALLEL | |
Standby Current-Max | 0.0001 A | |
Supply Current-Max | 0.175 mA | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | MATTE TIN | |
Terminal Form | J BEND | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Width | 11.455 mm |